Advances in Parylene Adhesive Bonding for the Realization of Biocompatible Microsystems
Franz Selbmann,
Frank Roscher,
Maik Wiemer
et al.
Abstract:Wafer to wafer and chip to wafer bonding technologies are a key enabling processes for the fabrication of microsystems. The presented paper focuses on the latest research results of Parylene adhesive bonding. Given the established wafer bonding processes based on Parylene C in vacuum, research on how the bonding process alters the Parylene material was performed using x-ray diffraction. Doing so, a significant increase of the crystalline fraction of Parylene was observed. In order to further develop the Paryle… Show more
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