2022
DOI: 10.1007/978-3-030-93441-5_10
|View full text |Cite
|
Sign up to set email alerts
|

Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2022
2022
2022
2022

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(1 citation statement)
references
References 48 publications
0
1
0
Order By: Relevance
“…These properties allow them to be widely used in sensor, optical, magnetic, and thermal devices, as well as in catalysis. Among metal nanoparticles, copper (Cu) nanoparticles are among the most widely used materials due to their lower cost, easy mixing with polymers [ 1 ], excellent electrical [ 2 ] and thermal conductivity [ 1 , 3 ], shorter reaction time compared with conventional catalysts [ 4 ], excellent solderability [ 5 ], low cytotoxicity [ 6 ], and antifungal and anticancer properties [ 7 ]. In the last decade, there has been a rapid increase in interest in textiles modified with copper particles, which acquire a number of useful properties, such as electromagnetic interference (EMI) shielding [ 8 ], high electrical conductivity [ 9 ], photocatalytic [ 10 ], hydrophobic [ 11 ], and especially antibacterial and antiviral properties [ 12 , 13 , 14 ].…”
Section: Introductionmentioning
confidence: 99%
“…These properties allow them to be widely used in sensor, optical, magnetic, and thermal devices, as well as in catalysis. Among metal nanoparticles, copper (Cu) nanoparticles are among the most widely used materials due to their lower cost, easy mixing with polymers [ 1 ], excellent electrical [ 2 ] and thermal conductivity [ 1 , 3 ], shorter reaction time compared with conventional catalysts [ 4 ], excellent solderability [ 5 ], low cytotoxicity [ 6 ], and antifungal and anticancer properties [ 7 ]. In the last decade, there has been a rapid increase in interest in textiles modified with copper particles, which acquire a number of useful properties, such as electromagnetic interference (EMI) shielding [ 8 ], high electrical conductivity [ 9 ], photocatalytic [ 10 ], hydrophobic [ 11 ], and especially antibacterial and antiviral properties [ 12 , 13 , 14 ].…”
Section: Introductionmentioning
confidence: 99%