2021
DOI: 10.1007/s41403-021-00263-6
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Advancement and Challenges for Schottkey Barrier MIS/SIS Solar Cells: A Review

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Cited by 2 publications
(1 citation statement)
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“…Due to an uncomplicated and economical fabrication process, such as the direct deposition of a thin metal layer on a polycrystalline semiconductor wafer, the Schottky barrier has received high consideration from science society [1][2][3]. Unfortunately, this benefit concurrently turns into a drawback since the thickness of the thin metal layer will negatively impact the light absorption of the semiconductor [4]. Thanks to intense research efforts, several methods are issued to improve this matter [5][6][7].…”
Section: Introductionmentioning
confidence: 99%
“…Due to an uncomplicated and economical fabrication process, such as the direct deposition of a thin metal layer on a polycrystalline semiconductor wafer, the Schottky barrier has received high consideration from science society [1][2][3]. Unfortunately, this benefit concurrently turns into a drawback since the thickness of the thin metal layer will negatively impact the light absorption of the semiconductor [4]. Thanks to intense research efforts, several methods are issued to improve this matter [5][6][7].…”
Section: Introductionmentioning
confidence: 99%