Abstract:The use of a conventional thermal cross-link materials such as negative resists, anti-reflective coating (BARC), and planarizing layers does not lead to excellent planarization for multilevel interconnects, and specially via arrays prior to trench patterning for an advance lithography.The large thicknesses bias between the blanket areas and interconnect areas, and between the blanket areas and via arrays are usually observed. This large thickness bias creates problems during next lithography by narrowing the p… Show more
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