Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344)
DOI: 10.1109/ias.2002.1042786
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Advanced SPICE modeling of large power IGBT modules

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Cited by 11 publications
(3 citation statements)
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“…As the heat power dissipation of the IGBT is a key parameter for the thermal study, it should be calculated using an electrical model. Several electrical models are presented in the literature [10,[17][18][19][20][21][22]. There are those based on the concept of the equivalent circuit [10,19,20], and those based on the analysis of the different material layers that compose the IGBT structure [18,23].…”
Section: Introductionmentioning
confidence: 99%
“…As the heat power dissipation of the IGBT is a key parameter for the thermal study, it should be calculated using an electrical model. Several electrical models are presented in the literature [10,[17][18][19][20][21][22]. There are those based on the concept of the equivalent circuit [10,19,20], and those based on the analysis of the different material layers that compose the IGBT structure [18,23].…”
Section: Introductionmentioning
confidence: 99%
“…As a result, while calculating the efficiency of a converter, one should also consider the variation of the losses for each wind speed to clarify the effectiveness of a specific converter for the entire wind speed regime. A calculation of converter efficiency for a given operating condition is performed in [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19] in terms of the total semiconductor power losses.…”
Section: Introductionmentioning
confidence: 99%
“…Thirdly, physics-based simulation models of semiconductor devices power losses requires implicit integration methods, leading to an increased simulation time. Furthermore, it requires detail knowledge of the dimensions of the devices [14,15]. There have been numerous other efforts for modeling the power losses of converters used in wind turbine systems.…”
Section: Introductionmentioning
confidence: 99%