2017
DOI: 10.1007/978-981-10-4433-5_10
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Advanced Specimen Preparation

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“…The SEM preparation procedure is harder than the AFM one ( Figure 5 ). In particular, the cell surface flattening observed in SEM micrographs is probably due to the sputter coating (a process which applies an ultra-thin coating of electrically-conducting metal in a non-conducting or poorly conducting specimen ( Brodusch et al, 2018 ), not involved in the AFM preparation procedure. The details obtained by analyzing the samples by AFM, but not by SEM, can be crucial to fully investigate the dynamics of the budding phenomena under H2O2 exposure, compensating for the higher analysis time needed to perform the AFM images with respect to the SEM scanning (i.e., two days versus a few hours, respectively).…”
Section: Discussionmentioning
confidence: 99%
“…The SEM preparation procedure is harder than the AFM one ( Figure 5 ). In particular, the cell surface flattening observed in SEM micrographs is probably due to the sputter coating (a process which applies an ultra-thin coating of electrically-conducting metal in a non-conducting or poorly conducting specimen ( Brodusch et al, 2018 ), not involved in the AFM preparation procedure. The details obtained by analyzing the samples by AFM, but not by SEM, can be crucial to fully investigate the dynamics of the budding phenomena under H2O2 exposure, compensating for the higher analysis time needed to perform the AFM images with respect to the SEM scanning (i.e., two days versus a few hours, respectively).…”
Section: Discussionmentioning
confidence: 99%