Advanced pattern defect detection and analysis with artificial intelligence
Sangchul Yeo,
Yongsun Jang,
Yeongju Guk
et al.
Abstract:As semiconductor process technology needs to be advanced, the difficulty of patterning increases and unexpected pattern defects occur. In fact, it is very important to quickly identify and resolve these pattern defects in advance, but there is a limit to measuring all of these pattern defects that occur in wafers. In particular, in order to overcome metrological limitations, it may be best to extract actual potential pattern defects by classifying various types of patterns that actually exist. We measured how … Show more
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