Advanced Micro-/Nanostructured Wicks for Passive Phase-Change Cooling Systems

Evaluation of Evaporation Fluxes for Pesticides and Low Volatile Hazardous Materials Based on Evaporation Kinetics of Net Liquids

“…For the first test, we took "as is" previously collected and published 17 evaporation fluxes for 51 compounds measured at 298 K according to the ASTM D3539 test. 20 These experimental conditions and the method differ from those used in our investigation. The results of experimental data fitting according to eqs 6 and 7 are shown in Figure 2.…”

“…According to ASTM method D3539-87, a known volume of liquid is added to a known area of filter paper placed in a thin-film evaporometer, a cabinet with a balance. The dried air is passed through the cabinet, and evaporation kinetics is measured from 10 to 90% of the mass loss. , However, evaporation from thin liquid films depends on the thickness of the film, wettability, porosity, texture, and other properties of the material from which evaporation occurs. ,− Micro- and nanosized films are formed near the container walls or fibers of the material . It is challenging to maintain the film to have the same thickness during an experiment when a significant amount of liquid evaporates.…”

“…The dried air is passed through the cabinet, and evaporation kinetics is measured from 10 to 90% of the mass loss. 5,20 However, evaporation from thin liquid films depends on the thickness of the film, wettability, porosity, texture, and other properties of the material from which evaporation occurs. 14,21−23 Micro-and nanosized films are formed near the container walls or fibers of the material.…”

“…Several empirical approaches were proposed to establish a correlation between evaporation rates and the physical properties of volatile compounds and their vapors. 3,5,18 Experimental results were summarized, analyzed, and presented as the database, 17 which includes evaporation fluxes obtained by the ASTM D3539-87 evaporation rate test 20 for 51 compounds covering a broad range of fluxes from 5.04 × 10 −4 kg m −2 s −1 (acetone) to 1.27 × 10 −11 kg m −2 s −1 (pp′-DDT).…”

Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration

“…To accomplish this, various methods and materials can be used. These can range from basic thermal management supplies, such as thermal paste/grease, thermal pads, and solder bonds [26,27], to advanced micro-scale thermal management developments, such as carbon/metal microtubes, microchannel cooling, and wicking structures depending on specific device and heat management needs [28,29]. Some of these micro-structures can even be fabricated in conjunction with each other to form pseudo-heat pipes at a micro-scale, allowing for increased heat dissipation rates while maintaining device scaling and performance [30].…”