Advanced MCM-D micro-processor module for ATM wide-area network switching systems

Kawamura, Teruo; Yamanaka, Naoaki; Kaizu, K.; Harada, Akio; Yashiro, Z.

doi:10.1109/iemte.1998.723052

Cited by 1 publication

(1 citation statement)

References 3 publications

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“…14. It measures 125 x 140 mm and mounts two CSPs, a micro-processor, a RAM-multi-chip module, a bus control, and driver/receiver ICs on both si&s [6]. It is mounted on a motherboard by means of stack connectors.…”

Section: Applicationmentioning

confidence: 99%

Development of plastic chip scale package for ATM switching systems

Harada

Kaizu

Yamanaka

et al.

Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)

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A plastic chip-scale package (CSP) smaller than conventional ones has been developed and applied to ATM switching systems. It uses a lowcost glass-epoxy substrate. Because glass epoxy is widely used in the printed circuit boards (PCBs) of ATM switching systems, its use in the CSPs mounted on a PCB d u c e s the difference in thermal expansion between the PCB and CSPs, thus lengthening CSP life. The power plane, ground plane, and thermal vias of the CSP are designed to offset the increased thermal resistance &e to the CSP's smaller size. Simulation showed a thermal resistance for this CSI' with copper layers and thermal vias of as much as 22% less than that of one with no copper layers or thermal vias. A six-layer test board mounting four CSPs was used to simulate a sub-board for ATM switching systems. The thermal resistance of the two CSPs located downstream was about 10% higher ttian that of the two located upstream. Two CSPs were developed for two types of application-specific ICs: a bus interface controller @IC) and a peripheral interface circuit (PIC). Both CSPs were18 mm square with a 0.8-mm outer solder-ball pitch and 256 outer balls. These CSPs m p i e d areas about 87% and 68% smaller than those of a conventional pin grid m y (PGA) and quad flat package (QFP), respectively. The junction temperature of both CSPs satisfied the thermal condition. Thesehigh-performance CSPs are thus attractive for use in ATM switching systems.

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Section: Applicationmentioning

confidence: 99%