Abstract:This paper describes a method for automatically inspecting the top edge region of a wafer for defects and how this method was used to evaluate process improvements. The need for such an inspection was driven by a within wafer defect problem first seen on product. The root cause of the defect was found to be the redistribution of certain defect types from the wafer edge exclusion region into the product area. Process partition and manual inspection using a scanning electron microscope (SEM) revealed the mechani… Show more
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