Advanced localization technique of failures in packages / IO-stages of chips using Vector Network Analyser

Krueger, Benjamin; Pohl, Hans-Martin; Schümann, F.; Schoemann, S.

doi:10.1109/ipfa.2008.4588163

Cited by 6 publications

(4 citation statements)

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“…TDR can at best provide spatial resolution of about 1 mm [1]. Modification of the TDR technique involves taking data in the frequency domain with the Vector Network Analyzer (VNA) [6]. Recently, Electro Optical Terahertz Pulse Reflectometry (EOTPR) has been introduced [15], which applies terahertz frequency to to a standard part.…”

Section: Figure 1 the Bathtub Curvementioning

confidence: 99%

Reliability Trends of New ICs Generations

Titu-Marius¹

2020

EEA

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Reliability is the ability of a part or product to perform as intended (i.e., without failure and within specified performance limits) for a specified time, in its life cycle application environment. Reliability specification and demonstration is an activity between customers and suppliers. Because high IC reliability is an inherent quality that is partly derived not only from the soundness of the IC chip's design, but also from the degree of process control and cleanliness and the integrity of the IC-chip package and interconnections, failures tend to be lot-related. So, although a good reliability track record for one vendor's IC type means a reasonable probability that the vendor's next shipped lot of the same IC type will have the same high-reliability characteristics; there is no guarantee that such a lot will not exhibit abnormally high failure rates -and such things do happen, causing IC users to be constantly on the watch.

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Section: Figure 1 the Bathtub Curvementioning

confidence: 99%

Reliability Trends of New ICs Generations

Titu-Marius¹

2020

EEA

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“…TDR uses a pulse generator and a high-speed oscilloscope to record in real time the reflection of a microwave signal by the open barrier [3,4]. TDR can at best provide resolution of about 1 mm making it most suitable for the high-pincount packages, such as quad flat package and ball grid array, but less convenient for smaller packages (less than 1 cm 2 ) [5], and more or less impossible to use on the latest development for connecting dies in wafer leveling packaging using microbumps.…”

Section: Time Domain Reflectometrymentioning

confidence: 99%

“…The time domain signal can then be calculated by inverse Fourier-Transformation of the frequency domain data. The effect of improved detail resolution with increasing bandwidth is well known and the bandwidth can be as high as 110 GHz for a VNA [4].…”

Section: Time Domain Reflectometrymentioning

confidence: 99%

Space Domain Reflectometry for opens detection location in microbumps

Gaudestad

Talanov

Huang

2012

Microelectronics Reliability

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“…In addition to this poor spatial resolution, multiple echo tend to jeopardize the TDR measurements (Fig. 23 Recent progress in Time Domain Reflectometry slightly increases the performances by using a frequency analysis based approach instead of time domain analysis [15].…”

Section: Resistive Pathmentioning

confidence: 99%

Facing more than moore, is magnetic microscopy the new Swiss knife for 3D defect localization in SiP?

Perdu

Infante

2010

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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So far, most of the defects at system level are assembly related. This trend obviously concerns Systems in Package, Stacked dies, Packages on Package devices, passive integration, integration of logic, power, wireless, analog, sensor and actuator in the same packaged device… All these Systems in Package defy our failure localization tools. For the first time, we have to face non transparent material, massive 3D structure with mandatory long working distance and need of relatively high spatial resolution. Magnetic microscopy has the ability do this as long as we are able to adapt its principle to the mandatory 3D sensitivity and resolution. We have developed a global 3D approach based on simulation in order to target µm resolution at long working distance.

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Advanced localization technique of failures in packages / IO-stages of chips using Vector Network Analyser

Cited by 6 publications

References 0 publications

Reliability Trends of New ICs Generations

Reliability Trends of New ICs Generations

Space Domain Reflectometry for opens detection location in microbumps

Facing more than moore, is magnetic microscopy the new Swiss knife for 3D defect localization in SiP?

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