Advanced Cu interconnects using air gaps

Gosset, L.G.; Farcy, A.; Pontcharra, J. de; Lyan, Ph.; Daamen, R.; Verheijden, G. J. A. M.; Arnal, V.; Gaillard, F.; Bouchu, D.; Bancken, P.; Vandeweyer, T.; Michelon, J.; Hoang, V. Nguyen; Hoofman, R.J.O.M.; Torrès, J.

doi:10.1016/j.mee.2005.07.014

Cited by 28 publications

(11 citation statements)

References 9 publications

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“…Our multi-tier pathways can be considered as "airgap" circuits, with vacuum as a dielectric medium between the metallization lines providing the ideal dielectric separation between them. 17 Such multi-tier architectures can be used to address the parasitic capacitance occurring in closely-spaced metallization lines. 17 In order to investigate the stability of our CNT-Cu pathways, we implemented lifetime evaluation at high current densities (10 7 -10 8 A cm −2 ) and temperatures (250 °C) that Cu cannot withstand (Fig.…”

Section: Resultsmentioning

confidence: 99%

Nano-scale, planar and multi-tiered current pathways from a carbon nanotube–copper composite with high conductivity, ampacity and stability

et al. 2016

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New lithographically processable materials with high ampacity are in demand to meet the increasing requirement for high operational current density at high temperatures existing in current pathways within electronic devices. To meet this demand, we report an approach to fabricate a high ampacity (∼100 times higher than Cu) carbon nanotube-copper (CNT-Cu) composite into a variety of complex nano-scale, planar and multi-tiered current pathways. The approach involved the use of a two-stage electrodeposition of copper into a pre-patterned template of porous, thin CNT sheets acting as the electrode. The versatility of this approach enabled the realization of completely suspended multi-tier, dielectric-less 'air-gap' CNT-Cu circuits that could be electrically isolated from each other and are challenging to fabricate with pure Cu or any metal. Importantly, all such complex structures, ranging from 500 nm to 20 μm in width, exhibited ∼100-times higher ampacity than any known metal, with comparable electrical conductivity as Cu. In addition, CNT-Cu structures also exhibited a superior temperature stability compared to the ∼10-times wider Cu counterparts. We believe that the combination of our approach and the properties demonstrated here are vital achievements for the future development of efficient and powerful electrical devices.

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Section: Resultsmentioning

confidence: 99%

Nano-scale, planar and multi-tiered current pathways from a carbon nanotube–copper composite with high conductivity, ampacity and stability

et al. 2016

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“…16,17 In addition, sacrificial materials that are removed through wet etching rather than thermal processing have been used with the aim of lowering the total thermal budget of IC fabrication. 18,19 A previous study 12 has indicated that polyLA is a potential candidate for use as a sacrificial polymer, therefore knowledge of the adhesion and solubility characteristics are important for this and other potential applications.…”

Section: Introductionmentioning

confidence: 99%

Solubility and adhesion characteristics of plasma polymerized thin films derived from Lavandula angustifolia essential oil

Easton

Jacob

2009

J of Applied Polymer Sci

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in Wiley InterScience (www.interscience.wiley.com).ABSTRACT: Integration and implementation of organic polymer thin films often require knowledge of the stability when in contact with solvents and the adhesion quality when applied to different substrates. This article describes the solubility and adhesion characteristics of organic polymer thin films produced from Lavandula angustifolia essential oil, using radio frequency plasma polymerization at four RF power levels. Contact angle data was obtained for various solvents and used to determine the surface tension values for the polymer by using three established methods. A relatively strong electrondonor component and a negligible electronic acceptor component for the polymers indicate that they are monopolar in nature. Solubility data derived from interfacial tension values suggest that the polymers would resist solubilization from the solvents explored. The strongest solvophobic response was assigned to water, whereas diiodomethane demonstrated the weakest solvophobic response, with DG 121 > 0 in some instances depending on the surface tension values used. The adhesion tests of the polymers deposited on glass, PET, and PS indicated that the adhesion quality of the thin film improved with RF power, and it was associated with an improvement in interfacial bonding.

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“…An intermediate topology is also selected which groups minimum width interline and dielectric filling between to adjacent interconnects. It concerns consequently an air gap filling [20] [21].…”

Section: Numerical Resultsmentioning

confidence: 99%

Full Wave Analysis and Electrical Modeling of Eight Copper Interconnects Placed in a Giga-Scale Integrated Environment for Signal Integrity Evaluation

Ponchel¹,

Legier²,

Paleczny³

et al. 2006

2006 1st Electronic Systemintegration Technology Conference

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Signal integrity analysis on eight unintentionally coupled copper interconnects is derived from an equivalent distributed electrical multi-conductor cell. Compatible with SPICE environment, this elementary cell is calculated with a full wave analysis such as tangential vector finite element method and the transmission line theory. After R, L, C, G and mutual extraction, two types of excitation are implemented based on one aggressor and seven victims and vice versa in order to weigh the influence of parasitic mutual via crosstalk evaluation.

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Advanced Cu interconnects using air gaps

Cited by 28 publications

References 9 publications

Nano-scale, planar and multi-tiered current pathways from a carbon nanotube–copper composite with high conductivity, ampacity and stability

Nano-scale, planar and multi-tiered current pathways from a carbon nanotube–copper composite with high conductivity, ampacity and stability

Solubility and adhesion characteristics of plasma polymerized thin films derived from Lavandula angustifolia essential oil

Full Wave Analysis and Electrical Modeling of Eight Copper Interconnects Placed in a Giga-Scale Integrated Environment for Signal Integrity Evaluation

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