Advanced CerMet ceramic composites for medical applications

Dittmer, Robert; Schaefer, Christian M.; Fischer, J; Hausch, Ulrich; Troetzschel, Jens; Specht, Heiko

doi:10.1016/j.jmbbm.2017.07.024

Cited by 8 publications

(4 citation statements)

References 12 publications

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“…In these applications alumina is used widely as a substrate material for electrical circuits, electrical insulators or as a hermetic shell to protect the implant electronics from the surrounding tissue and vice versa. Ceramics exhibit advantages like mechanical strength, high hermeticity, are electrochemically stable and therefore do not corrode within the body [8]. Ceramics can also be used within non-hermetic packaging as substrate for printed circuit boards (PCB) to interconnect, for example, polymer based thin film electrodes with transcutaneous cables [9].…”

Section: Introductionmentioning

confidence: 99%

Thin Film Metallization Stacks Serve as Reliable Conductors on Ceramic-Based Substrates for Active Implants

Kiele

Čvančara

Langenmair

et al. 2020

IEEE Trans. Compon., Packag. Manufact. Technol.

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Hermetic and non-hermetic packages of active implantable medical devices are often fabricated of ceramics like alumina. Screen printed PtAu paste is the state of the art metallization for functional structures. Due to solid state and liquid diffusion of Au at thermal exposure, solder times are limited; otherwise metal structures tend to delaminate. Moreover, it was shown that PtAu with solder fails after 37.4 years. We established a thin film metallization on alumina process to overcome these disadvantages. The metallization consists of sputtered platinum with an underlying adhesion layer made of tungsten-titanium to increase the adhesion strength to the alumina substrate. We avoided using gold in this work due to its high diffusion tendency. Instead, the materials in use provide relatively low diffusion properties, which potentially increases the long term mechanical performance and usability during assembly and packaging.Utilizing the Design of Experiment (DoE) methodology, we derived an optimal Pt thickness of 500 nm with 43 nm of WTi as adhesion promoting layer. After accelerated aging at 150 °C, corresponding to 125 years at body temperature (37 °C), the contact pad adhesion strength was with 32.75 MPa ± 7.08 MPa still significantly higher than the safety limit of 17 MPa, following the recommendations for a robust screen-printing metallization process. Moreover, soldering times of up to 120 s did not influence the adhesive strength. The new process reduced the minimum track distance to 50% of screen printing values and is capable of rapid prototyping. It helps to make the assembly process independent of the manufacturing person, to increase the yield of device fabrication and -most important in implantable device manufacturing-to make it more robust and thereby more safe for the patient.

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Section: Introductionmentioning

confidence: 99%

Thin Film Metallization Stacks Serve as Reliable Conductors on Ceramic-Based Substrates for Active Implants

Kiele

Čvančara

Langenmair

et al. 2020

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…Ceramic-metal composites, due to their unique properties, are an object of desire as functional and construction materials in specialized applications of electronic technology, medicine and aeronautics [ 1 , 2 ]. The introduction of the metallic phase dispersion into the ceramic matrix enables the shaping of a number of composite properties, such as its thermal, magnetic and electrical conductivity [ 3 , 4 , 5 ].…”

Section: Introductionmentioning

confidence: 99%

Properties of Al2O3/Ti/Ni Composite Obtained by Slip Casting with Different Metal Phase Content

et al. 2022

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This work analyzed ceramic-metal composites from the Al2O3/Ti/Ni system produced by the slip casting method. As starting powders, nanometric Al2O3, Ni and Ti of submicron size were used. Three series of composites were obtained and tested with the same solid phase content (50% vol.) and different metallic phase content: 5, 10 and 15% vol. The influence of the metallic phase content on the basic properties of the proposed composites was examined by determining the phase composition of the produced samples using the XRD method, rheological measurements, and microstructural analysis (SEM/EDS). Additionally, before the sintering process, the slip stability was analyzed. A study of the fractography of samples after the sintering process was also carried out. It was shown that the appropriate manufacturing process allowed to obtain NiTi intermetallic phases in the structure of composites.

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“…The selection of appropriate metallic components allows the sintering process to create new phases [2][3][4], including intermetallic ones [5][6][7], thereby obtaining unique properties of the composite [7][8][9]. Taking the advantage of the properties of the individual materials (e.g., the electric conductivity and ductility of metal and the hardness and heatresistance of ceramics) has made ceramic-metal composites very promising materials for use in biomedical [10], aerospace [11], electrotechnics [12], and other engineering applications [13,14].…”

Section: Introductionmentioning

confidence: 99%

Manufacturing of Al2O3/Ni/Ti Composites Enhanced by Intermetallic Phases

et al. 2021

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In this study, ceramic–metal composites in the Al2O3/Ti/Ni system were fabricated using the slip casting method. Two series of composites with 15 vol.% metal content and different solid phase contents were obtained and examined. A proper fabrication process allows obtaining composites enhanced by intermetallic phases. The microstructure of the base powders, slurries, and sintered composites was analyzed by scanning electron microscope. Analysis of the sedimentation tendency of slurries was carried out. The phase composition of the sintered samples was examined by X-ray diffraction analysis. A monotonic compression test was used to investigate the mechanical properties of the composites. A fractography investigation was also carried out. The research conducted revealed that the slip casting method allows the obtaining of composites enhanced by intermetallic phases (TiNi, Ni3Ti). The results show the correlation between solid-phase content, microstructure, and mechanical properties of the composites.

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Advanced CerMet ceramic composites for medical applications

Cited by 8 publications

References 12 publications

Thin Film Metallization Stacks Serve as Reliable Conductors on Ceramic-Based Substrates for Active Implants

Thin Film Metallization Stacks Serve as Reliable Conductors on Ceramic-Based Substrates for Active Implants

Properties of Al2O3/Ti/Ni Composite Obtained by Slip Casting with Different Metal Phase Content

Manufacturing of Al2O3/Ni/Ti Composites Enhanced by Intermetallic Phases

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