Adsorption of thiourea at the polycrystalline silver electrode from aqueous KF solutions—II

Miłkowska, Magdalena

doi:10.1016/0013-4686(88)80049-5

Cited by 12 publications

(3 citation statements)

References 5 publications

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“…For other substrates higher adsorption energies were reported: -91.6 k J/tool for bismuth, 2~ -95.7 kJ/mol for mercury, 21 and -85.5 kJ/ mol for silver. 22 On gold TU can be easily oxidized at positive electrode potentials. Various forms of sulfur, as well as gold-sulfur adducts were identified as reaction products.…”

Section: Introductionmentioning

confidence: 99%

Copper Deposition onto Au(111) in the Presence of Thiourea

Hölzle

Apsel

Will

et al. 1995

J. Electrochem. Soc.

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The influence of thiourea on the initial stages of Cu deposition on an Au(l 1 i) electrode has been studied by potentialstep experiments and by in situ scanning tunneling microscopy. It is shown that adsorbed thiourea prevents the formation of a uniform Cu monolayer at underpotentials. The resulting island structure of the underpotential deposited layer provides many nucleation sites on the gold terraces and hence affects the nucleation habit of bulk Cu markedly. From an analysis of the current transients the critical nucleation parameters, size, and free enthalpy of formation of the critical nucleus, have been derived. The possible role of thiourea in the observed changes of the nucleation parameters and the deposition rates with the additive concentration is discussed.

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Section: Introductionmentioning

confidence: 99%

Copper Deposition onto Au(111) in the Presence of Thiourea

Hölzle

Apsel

Will

et al. 1995

J. Electrochem. Soc.

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“…50,51 TU is adsorbed on copper [52][53][54][55][56][57] and silver electrodes. 53,[58][59][60][61] Therefore, the TU-silver complexes are more readily adsorbed on copper and silver substrates than uncomplexed tin ions. It is postulated that the adsorbed TU-silver complex ions are discharged and deposited, forming nucleation sites for tin deposition.…”

Section: Resultsmentioning

confidence: 99%

Nucleation of Tin and Tin–Silver Alloy on Copper and Nickel in Acid Plating Baths

Zhang

Barkey

2007

J. Electrochem. Soc.

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The rate of nucleation and number density of nuclei of tin and tin-silver deposits on copper and nickel substrates in acid sulfate and acid methanesulfonate baths were measured by application of a nucleation model to chronoamperometric data. Based on the dependence of nucleation rate on overpotential, the critical Gibbs free energy of nucleation and the critical nucleation size were calculated. A mechanism of alloy nucleation in the presence of thiourea is proposed.

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“…Since thiourea molecules exhibit opposite influence on the hydrogen ion discharge reaction in acidic and neutral media, the adsorption of TU on Cu monocrystalline electrodes in neutral solution seemed to be worth of study. Based upon the earlier data on the adsorption of TU on gold [19][20][21][22] and silver [23][24][25][26][27][28] electrodes, we attempt to discuss the role of the kind of the metal and its crystallographic structure on the adsorption process.…”

Section: Introductionmentioning

confidence: 99%