Adsorption of organic probes on silica through Lewis interactions: A comparison of experimental results and quantum chemical calculations

Granqvist, B.; Sandberg, Thomas; Hotokka, Matti

doi:10.1016/j.jcis.2007.02.008

Cited by 17 publications

(11 citation statements)

References 29 publications

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“…It was shown that adsorption of different polar organic probes on a partly dehydroxylated silica surface occurred through Lewis interactions [75].…”

Section: Pvp-silica Interactions As Estimated From Mid-and Far-ir Spementioning

confidence: 99%

Well-defined silica core–poly(vinyl pyrrolidone) shell nanoparticles: Interactions and multi-modal glass transition dynamics at interfaces

Bershteĭn¹,

Gun'ko²,

Egorova³

et al. 2009

Polymer

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“…It was shown that adsorption of different polar organic probes on a partly dehydroxylated silica surface occurred through Lewis interactions [75].…”

Section: Pvp-silica Interactions As Estimated From Mid-and Far-ir Spementioning

confidence: 99%

Well-defined silica core–poly(vinyl pyrrolidone) shell nanoparticles: Interactions and multi-modal glass transition dynamics at interfaces

Bershteĭn¹,

Gun'ko²,

Egorova³

et al. 2009

Polymer

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“…The adsorption of pyridnium ion is driven by either electrostatic interaction of the positively charged pyridinium ion with the fewer negatively charged silanolates or by hydrogen bonding between the protonated amino group (≡N + -H δ+ ) of the pyridinium ion, a hydrogen bond donor, and the predominant silanol groups, 13 hydrogen bond acceptors, on the silica surface. Several authors [12][13][14][15][16][17][18][19] suggested that the lone pair of electrons from the electronegative oxygen atom of the silanol (≡SiO δ− H δ+ ) group has only a weak attraction toward hydrogen bond donors, for example the protonated amine groups in our case. Hence, the resulting hydrogen bonding is weak and the electrostatic adsorption of the charged pyridinium ion is more likely the cause of the observed reduction in oxide RR.…”

Section: Ecs Journal Of Solid State Science Andmentioning

confidence: 77%

Further Investigation of Slurry Additives for Selective Polishing of SiO₂Films over Si₃N₄Using Ceria Dispersions

Penta

Amanapu

Babu

2015

ECS J. Solid State Sci. Technol.

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Following our earlier analysis of amino acids, we investigated the effectiveness of acetic acid, pyridine, and sorbitol that were chosen to represent carboxylic acid, amine and alcohol functional group families, respectively, as additives in ceria dispersions for polishing SiO 2 and Si 3 N 4 films. By comparing the speciation of the additives available and the material removal rates with respect to pH, we identified that the removal rates of nitride, but not oxide, are suppressed to <1 nm/min in the pH range where the additive species containing a protonated amino group or a neutral carboxylic group or a neutral hydroxyl group are dominant. All of these species are strong hydrogen bond donors and can form strong hydrogen bonds with Si 3 N 4 surface while their corresponding bonding on SiO 2 surface sites is weaker. The stronger hydrogen bonding hinders Si 3 N 4 hydrolysis and suppresses Si 3 N 4 removal. In contrast, the weakly bound additive species are easily removed from the SiO 2 surface by the polishing pad and the ceria abrasives, leading to high SiO 2 to Si 3 N 4 removal rate selectivity. Similar results were also obtained with valeric acid, imidazole, glucose, sucrose, and mannitol, confirming the importance of a strong hydrogen bond formation in a broader class of additives. Shallow trench isolation (STI), which helps isolate the transistors and prevents shorting and cross-talk, is a widely used process in semiconductor device fabrication. The STI process includes the deposition of silicon nitride on a thermally grown pad oxide followed by the etching of a shallow trench into the silicon substrate. A layer of silicon oxide such as tetraethyl ortho silicate (TEOS) oxide, high density plasma (HDP) oxide, or high aspect ratio process (HARP) oxide is deposited on the entire substrate surface, not only filling the trenches but also creating an uneven topography. After the trenches are filled, the excess deposited oxide needs to be removed and the topography planarized before the fabrication of any IC elements. So far, chemical mechanical polishing/planarization (CMP) has been the only viable technique to remove the overburden oxide and planarize the topographies. This STI CMP step requires a slurry which polishes the overburden oxide with high oxide removal rate (RR) and stops on the underlying nitride surface with minimal nitride loss and oxide dishing.Ceria-based dispersions 1 containing various additives have a huge market position for planarizing these STI structures efficiently because of their superior ability to polish oxide films at high rates using only a low solids loading of ∼1 wt% or less and to stop on the underlying nitride film with minimal loss as well as dishing. 2,3 In the absence of any additive, these same ceria slurries would also produce significant nitride RRs and lead to considerable nitride loss. Hence, many types of additives (amino acids, amines, surfactants, polymers and acids) were investigated to achieve high oxide-to-nitride rate selectivity. 4-12For example, America and Babu ...

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“…The number of adsorption sites for benzyl amine (2.0/nm 2 ) is slightly lower than the previously reported [35] number of hydroxyl groups (2.9/nm 2 ) remaining at the surface after similar heat treatment. In our previous work [37] we reported that the alcohol, amine and acetic acid show both Lewis acid and Lewis base interactions with a silica surface while the acetone is a monodentate base. This observation has also received experimental support [38], indicating that strained siloxane bridges may act as coordination sites for adduct formation.…”

Section: Adsorption Isothermsmentioning

confidence: 97%

Acid–base interaction of probes at silica surface. Microcalorimetry and adsorption

Granqvist

Hedström

Rosenholm

2009

Journal of Colloid and Interface Science

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Adsorption of organic probes on silica through Lewis interactions: A comparison of experimental results and quantum chemical calculations

Cited by 17 publications

References 29 publications

Well-defined silica core–poly(vinyl pyrrolidone) shell nanoparticles: Interactions and multi-modal glass transition dynamics at interfaces

Well-defined silica core–poly(vinyl pyrrolidone) shell nanoparticles: Interactions and multi-modal glass transition dynamics at interfaces

Further Investigation of Slurry Additives for Selective Polishing of SiO₂Films over Si₃N₄Using Ceria Dispersions

Acid–base interaction of probes at silica surface. Microcalorimetry and adsorption

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Adsorption of organic probes on silica through Lewis interactions: A comparison of experimental results and quantum chemical calculations

Cited by 17 publications

References 29 publications

Well-defined silica core–poly(vinyl pyrrolidone) shell nanoparticles: Interactions and multi-modal glass transition dynamics at interfaces

Well-defined silica core–poly(vinyl pyrrolidone) shell nanoparticles: Interactions and multi-modal glass transition dynamics at interfaces

Further Investigation of Slurry Additives for Selective Polishing of SiO2Films over Si3N4Using Ceria Dispersions

Acid–base interaction of probes at silica surface. Microcalorimetry and adsorption

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Further Investigation of Slurry Additives for Selective Polishing of SiO₂Films over Si₃N₄Using Ceria Dispersions