Surface defects such as step edges play an important role in determining the surface properties, affecting immensely the growth mechanisms and morphologies of the nanostructures in epitaxial film growth processes. Here, we probe the dynamics of the oxidation on stepped Cu(100) using molecular dynamic simulations in conjunction with a reactive force field, and we elucidate the mechanisms and energy barriers affecting the oxidation process. Molecular dynamic simulations show that the adsorbed oxygen adatoms are unevenly distributed on the stepped surface, favoring the top terrace. We show that this behavior is due to Ehrlich− Schwobel (ES) barrier effect. However, differently from the reduced interlayer self-diffusion in descending a step as in a conventional ES barrier effect, we find instead that the ES barrier reduces the ascending diffusion barrier for oxygen, promoting its transport across the step edge and enhancing oxidation of the upper terrace. Additionally, we find that the ES barrier is stepheight dependent, where higher step edges reduce more the oxygen-ascending diffusion barrier and favor more oxidation of the upper terraces of stepped surfaces.
■ INTRODUCTIONSelf-assembly of nanostructures on thin films is of interest to several fields including catalysis, electronics, and information technology. 1−3 For many experimental conditions it is often that nanostructure growth is far from equilibrium where kinetic effects are of key importance in determining the growth morphology. 4 Depending on the nature of the supporting base and the deposited materials as well as the growth environment, nanostructures with different morphologies can self-assemble during homoepitaxial or heteroepitaxial film growth processes. Additionally, the existence of defects and, in particular, step edges on the substrate can have a profound effect on the self-assembly. For example, on copper, which is one of the best catalysts in heterogeneous catalysts, a recent in situ high-resolution transmission electron microscopy study showed that oxidation of stepped Cu(100) surfaces promotes formation of a flat metal− oxide interface through the Cu adatoms detachment from steps and diffusion across the terraces. 5 For stepped surfaces, one key question is whether the surface growth process promotes formation of a smooth two-dimensional (2D) film or a three-dimensional (3D) island structure. 6−9 In this respect, the Ehrlich−Schwobel (ES) barrier at the interlayer interface 10,11 has been shown to play an important role in determining the off-balance between these two growth mechanisms. The basic concept of the ES barrier is due to bond counting where an adatom approaching the ledge of a step sees less neighbors compared to the terrace, which in turn demotes the descending movement off a step edge. The ES barrier has been shown to reduce the interlayer mass exchange and promotes formation of 3D island structure in homoepitaxial and heteroepitaxial film growth. 6−8 There are several factors affecting the magnitude of the ES barrier, such as...