Adsorption Behavior of Coumarin onto a Concaved Substrate in Water under an Electric Field

Abstract

The in situ adsorption behavior of coumarin, a widely used inhibitor in nickel electrodeposition, onto a concaved substrate in water under an electric field was studied using atomic force microscopy (AFM). AFM images showed that under an electric field, coumarin adsorbs more preferentially on the edge of a concavity than on its inside, while the preferential bias of adsorption was not observed without an electric field. These results suggest that the preferential adsorption of coumarin onto a profiled substrate in water is driven by the electric field rather than by the conventionally suggested convective diffusion effect.

Investigation of poly (2-methyl imidazole co 1,4-butanediol diglycidyl ether) as a leveler for blind hole copper plating

“…To the best of our knowledge, currently reported dye-based leveler agents are JGB [20] , DB [21] , ABPV [22] , etc., and non-dye heterocyclic leveler agents are 2-amino-4-methylbenzothiazole (AMBT) [23] and 2-methlpyridine (2-MP) [24,25] , etc. The role of leveler agents is (1) to keep synergistically with inhibitors to inhibit the deposition of copper on the surface of the plated part; (2) to improve the current density and increase the hole-filling rate, thus avoiding the phenomenon of cavitation due to early sealing during the hole filling process [26][27][28][29][30][31] .…”

Investigation of poly (2-methyl imidazole co 1,4-butanediol diglycidyl ether) as a leveler for blind hole copper plating

“…To the best of our knowledge, currently reported dye-based leveler agents are JGB [20] , DB [21] , ABPV [22] , etc., and non-dye heterocyclic leveler agents are 2-amino-4-methylbenzothiazole (AMBT) [23] and 2-methlpyridine (2-MP) [24,25] , etc. The role of leveler agents is (1) to keep synergistically with inhibitors to inhibit the deposition of copper on the surface of the plated part; (2) to improve the current density and increase the hole-filling rate, thus avoiding the phenomenon of cavitation due to early sealing during the hole filling process [26][27][28][29][30][31] .…”

Inhibition effect of some aromatic amines on copper electrodeposition from acidic baths

“…The adsorption of inhibition agents can also occur if the heteroatom is another electronegative atom such as oxygen or nitrogen. Commonly used brighteners and leveling agents include polyethylene glycol, polypropylene glycol [2,9], and coumarine [10], as well as benzotriazole [11], saccharin [1,12,13], and picolinic acid [14]. The argument to use organic-nitrogen compounds is that the interaction is at least as strong as in case of sulfur compounds due to high adsorption energy at the metallic surface [15].…”