2017
DOI: 10.1587/elex.14.20170271
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Adjustable SQUID-resonator direct coupling in microwave SQUID multiplexer for TES microcalorimeter array

Abstract: Abstract:We have succeeded in the first demonstration of a simple and accurate resonator-superconducting quantum interference device (SQUID) coupling for microwave SQUID multiplexers. A simple theory shows our direct coupling with adjustable fractional inductance in the SQUID loop can decrease the deviation of resonance frequencies from designed values in contrast to a conventional inductive coupling. Our direct coupling provides the individual coupling that can be optimized with keeping identical structure, s… Show more

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Cited by 10 publications
(2 citation statements)
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“…Our possible setup is composed of two bold-italicλ/4 transmission line resonators coupled by a superconducting quantum interference device (SQUID) through the current ( Figure a). This coupling allows us to tune the cavity frequency and the coupling strength between each resonator . Moreover, two transmon qubits are capacitively coupled to the resonator through the voltage at the ends of the transmission line resonator.…”
Section: Implementation In Superconducting Circuitsmentioning
confidence: 99%
“…Our possible setup is composed of two bold-italicλ/4 transmission line resonators coupled by a superconducting quantum interference device (SQUID) through the current ( Figure a). This coupling allows us to tune the cavity frequency and the coupling strength between each resonator . Moreover, two transmon qubits are capacitively coupled to the resonator through the voltage at the ends of the transmission line resonator.…”
Section: Implementation In Superconducting Circuitsmentioning
confidence: 99%
“…While varnish or silver paste are used to mount a chip with low dissipation power such as superconducting sensors and so on [24,25], the use of them resulted in a significant temperature increase in the voltage standard chip due to large dissipation power. Thus, a silicon chip is solderbonded to a copper substrate to achieve good thermal contact between the chip and a cryocooler.…”
Section: Packaging For Cryocoolermentioning
confidence: 99%