2020
DOI: 10.1016/j.jallcom.2020.156410
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Adjustable effects of zinc substitution for indium on the thermoelectric properties of p-type CuInSe2.02

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Cited by 8 publications
(11 citation statements)
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“…材料的载流子热导率可以通过经典的Wiedemann- [35] , AgInTe 2 [38] , AgIn 5 Se 8 [30] 和 CuInSe 2 [39] 等, 且在平行于烧结压力方向上样品的晶 格热导率均低于垂直于烧结压力方向. 如沿着平行 烧结压力方向, y = 0.384样品室温时的晶格热导率…”
Section: 材料的热导率包括载流子热导率和晶格热导率两 部分 即unclassified
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“…材料的载流子热导率可以通过经典的Wiedemann- [35] , AgInTe 2 [38] , AgIn 5 Se 8 [30] 和 CuInSe 2 [39] 等, 且在平行于烧结压力方向上样品的晶 格热导率均低于垂直于烧结压力方向. 如沿着平行 烧结压力方向, y = 0.384样品室温时的晶格热导率…”
Section: 材料的热导率包括载流子热导率和晶格热导率两 部分 即unclassified
“…AgInTe 2 [38] , AgIn 5 Se 8 [30] 和CuInSe 2 [39] 的晶格热导率; (c) Ag y In 3.33-y/3 Se 5 , AgInSe 2 [35] , AgIn 5 Se 8 [30] , Ag 1.03 In 5 Se 8 [30] , Ag 0.9 Cd 0.1 InSe 8 [35] ,…”
Section: 结合实测的电热输运性能 我们计算了Ag Yunclassified
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“…(B) Current state‐of‐the‐art bulk diamondoid thermoelectric materials, the figure‐of‐merit ZT as a function of temperature and year illustrating important milestones, the red rectangular bars represent the n‐type materials, while green bars represent the p‐type ones. [ 101,102,107–128 ]…”
Section: Introductionmentioning
confidence: 99%
“…[ 101,103,107–109 ] Since then, diamondoid materials have attracted more attention in thermoelectricity, and researchers have discovered many high thermoelectric performance diamondoid compounds, such as Cu 2 ZnSnSe 4 , [ 108,136–138 ] CuInTe 2 , [ 139–142 ] CuGaTe 2 , [ 110,143–145 ] Cu 2 SnSe 3 , [ 146–148 ] and Cu 3 SbSe 4 , [ 111,149–152 ] as shown in Figure 1B. [ 101,102,107–128 ] The ZT values for the best p‐type diamondoid materials range from ~1.6 to 1.8, [ 110,111,121 ] while for n‐type materials, the highest ZT value is around 1.0. [ 127,153,154 ] In addition, a two‐couple diamondoid thermoelectric device was fabricated based on the p‐type Cu 0.99 In 0.6 Ga 0.4 Te 2 and n‐type Ag 0.9 Cd 0.1 InSe 2 , which shown a maximal output power of 0.06 W under a temperature difference of 520 K. [ 127 ] Because diamondoid materials form a large class of semiconductors that can often create solid solutions with each other, they offer a broad range of possibilities for customizing electronic and thermal properties.…”
Section: Introductionmentioning
confidence: 99%