Adhesive systems for low formaldehyde emission wood-based panels

Costa, Nuno

doi:10.1179/2042644514z.000000000108

Cited by 3 publications

(1 citation statement)

References 39 publications

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“…These could be also deduced from the microscopic images (Figure 5c,d), which showed the good interface of particles. Several researchers [70][71][72] have reported that bio-based formaldehyde scavengers with hydroxyl groups contribute both to the high internal cohesion of boards and the low formaldehyde emission of particleboards. Based on this theory, the D-glucose, which has hydroxyl groups in its composition, may act as formaldehyde scavenger [73], thus lowering the formaldehyde emission, as can be seen for LO 20 P1G and LO 20 P2G panels (Table 5 and Figure 7).…”

Section: Free Formaldehyde Emissionmentioning

confidence: 99%

Mechanical Properties and Formaldehyde Release of Particleboard Made with Lignin-Based Adhesives

et al. 2021

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The aim of this research was to evaluate the potential of magnesium lignosulfonate as adhesive in particleboard manufacturing. Diphenylmethane diisocyanate (PMDI) between 1% and 3% and glucose (1% of the lignosulfonate content) were added as potential cross-linkers in the adhesive formulations. Mixed beech and spruce wood, 30% beech wood and 70% spruce wood, were employed for the configuration of the panel structure. The density, mechanical properties and formaldehyde emission of single-layer particleboard were investigated. Spectroscopic analysis (FTIR) revealed structural changes brought by oxidation that may indicate depolymerization by the splitting of C-O-C bonds and formation of carbonyl groups. Mechanical properties were improved, and the highest average values were recorded for panels having as adhesives oxidized lignin with cross-linkers as follow: 15 N/mm2 (MOR), 3320 N/mm2 (MOE) and 0.48 N/mm2 (IB). The density profile presented higher values for faces in case of oxidized lignin panels. Changes were observed for oxidized lignin with cross-linker panels wherein the core had higher values. The results showed that the panels manufactured with adhesives composed of oxidized lignosulfonate (20% of the dried wood particles weight) and the addition of PMDI and glucose in various percentages have a positive influence on their formaldehyde release and mechanical properties requested by EN 312 (2004) standard.

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Section: Free Formaldehyde Emissionmentioning

confidence: 99%

Mechanical Properties and Formaldehyde Release of Particleboard Made with Lignin-Based Adhesives

et al. 2021

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Urea glyoxal and urea melamine glyoxal wood adhesives hardened with acid ionic liquid for particleboard pressing

2022

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Lignosulfonate and glycidyl ether modified urea formaldehyde wood adhesives for interior particleboard production

Alkan,

Kızılcan,

Bengü

2023

PRT

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Purpose The purpose of this study is the development of sustainable and low-formaldehyde emission wood adhesive formulations. Design/methodology/approach Three-step urea formaldehyde (UF) resin has been in situ modified with calcium lignosulfonate (LS) and/or 1,4 butanediol diglycidyl ether (GE). The structural, chemical, thermal and morphological characterizations were carried out on resin samples. These resins have been applied for particleboard pressing, and UF, UF-LS and UF-GE were evaluated as P2 classes according to EN 312. Findings The results show that the improved LS- or diglycidyl ether-modified UF wood adhesives were successful in their adhesive capacity, and the formaldehyde content of the final product was obtained as low as 8 mg/100 g. This paper highlights that the presented adhesive formulations could be a potential eco-friendly and cost-effective alternative to formaldehyde-based wood adhesives for interior particleboard production. Research limitations/implications Combination of LS and GE resulted in weaker mechanical properties and fulfilled P1 class particleboards due to temperature and duration conditions. Therefore, in situ usage of LS or GE in UF resins is highly recommended for particleboard pressing. Formaldehyde content of particleboards was determined with the perforator method according to EN 12460-5 and all of the particleboards exhibited E1 class. LS was more efficient in decreasing formaldehyde content than GE. Practical implications This study provides the application of particleboards with low formaldehyde emission. Social implications The developed LS- and diglycidyl ether-modified UF resins made it possible to obtain boards with significantly low formaldehyde content compared with commercial resins. Originality/value The developed formaldehyde-based resin formulation made it possible to produce laboratory-scale board prototypes using LS or GE without sacrificing of press factors and panel quality.

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Adhesive systems for low formaldehyde emission wood-based panels

Cited by 3 publications

References 39 publications

Mechanical Properties and Formaldehyde Release of Particleboard Made with Lignin-Based Adhesives

Mechanical Properties and Formaldehyde Release of Particleboard Made with Lignin-Based Adhesives

Urea glyoxal and urea melamine glyoxal wood adhesives hardened with acid ionic liquid for particleboard pressing

Lignosulfonate and glycidyl ether modified urea formaldehyde wood adhesives for interior particleboard production

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