Adhesive Properties and the Mechanisms of Epoxy Resins Including Mono-functional Monomers with High Polarity

Kishi, Hajime; Uesawa, Kazuhiko; Inada, Yuichiro; Nishida, Hitoshi; Matsuda, Satoshi; Sano, Noriaki; Murakami, Atsushi

doi:10.11618/adhesion.42.224

Cited by 1 publication

(1 citation statement)

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“…Moreover, it was found that the lap‐shear adhesive strength of the DAP resin modified with allyl ester compounds having hydroxyl group increased compared with that of DAP resin 14. And Kishi et al15 reported that the lap‐shear adhesive strength to metal of the epoxy resin having polar group increased with increasing the interfacial interaction between metal and epoxy resin.…”

Section: Introductionmentioning

confidence: 99%

Preparation and properties of cured diallyl phthalate resin modified with dimeric acid polyamide derivatives

Ohtsuka

Kimura

Matsumoto

et al. 2012

J of Applied Polymer Sci

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The allyl ester of dimeric acid polyamide, a compound which has a flexible unit in the main chain and reacts with the diallyl phthalate (DAP) resin to have an allyl group, was synthesized by the reaction of dimeric acid polyamide with allyl glycidyl ether. The allyl ester of dimeric acid polyamide was blended with DAP resin to improve the adhesive properties to metal. These blends were cured with dicumyl peroxide. By modification with allyl ester of dimeric acid polyamide, the T-peel adhesive strength to copper improved. This result is due to the increase in flexibility generated by introducing the unit of dimeric acid polyamide and subsequent increase in interfacial adhesive strength due to the amide bond being located in the surface of the copper plate. On the other hand, the lap-shear adhesive strength did not improve significantly because of the decrease in rigidity. On increasing concentration of allyl ester of dimeric acid polyamide, the glass-transition temperature slightly decreased, but there was little decrease of the thermal decomposition temperature. From scanning electron microscope observations, it was found that the DAP resin modified with allyl ester of dimeric acid polyamide formed a microphase-separated structure consisting of small dimeric acid polyamide particles dispersed in the DAP resin matrix. V C 2012 Wiley Periodicals, Inc. J Appl Polym Sci 126: E218-E224, 2012

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Section: Introductionmentioning

confidence: 99%