Adhesive bonding of textiles: principles, types of adhesive and methods of use

Petrie, Edward M.

doi:10.1533/9780857093967.2.225

Cited by 19 publications

(18 citation statements)

References 4 publications

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“…Conductive adhesives are widely used in the electronic packaging applications, such as die attach and solderless interconnections. For this purpose, different types of conductive adhesives for electronics packaging have been developed [ 116 , 117 , 118 ]. Snacaktar et al [ 119 ] and Mehmann et al [ 120 ] have studied epoxy-based adhesives used for joining electronics parts to fabric circuits.…”

Section: Integration Techniquesmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-Textile

et al. 2021

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Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical, and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable, and washable to offer a superior usability, comfortability, and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile-adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

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Section: Integration Techniquesmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-Textile

et al. 2021

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“…Conductive adhesives are widely used in the electronic packaging applications such as die attach and solder less interconnections. For this purpose, different types of conductive adhesives for electronics packaging have been developed [99][100][101]. Snacaktar et al [102] and Mehmann et al [103] have studied epoxy-based adhesives used for joining electronics parts to fabric circuits.…”

Section: Hybrid Solder and Sewing Integrationmentioning

confidence: 99%

Review on the Integration of Microelectronics for E-textile

Simegnaw¹,

Malengier²,

Gideon³

et al. 2021

Preprint

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Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable and washable to offer a superior usability, comfortability and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile- adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

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“…Adhesives contain resins based on thermoplastic, thermosetting polymers and elastomers. There are many different types of synthetic rubbers, including styrene-butadiene rubber (SBR), isobutylene isoprene rubber (IIR or butyl rubber), ethylene-propylene polymers (EPM), polychloroprene rubber (CR), nitrile butadiene rubber (NBR) and silicone rubber [ 18 ]. Some rubber-based adhesives require vulcanisation to achieve proper final strength.…”

Section: Introductionmentioning

confidence: 99%

Comparison of VOC Emissions Produced by Different Types of Adhesives Based on Test Chambers

Kozicki

Guzik

2021

Materials

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Volatile organic compounds (VOCs) emitted from building materials into the indoor air may cause discomfort associated with a perceptible chemical odour and may irritate the upper respiratory tract. Hence, it is vital to control indoor air pollution sources, such as interior finishing materials, including adhesives. The study involved carrying out a series of experimental tests of VOC emissions of 25 adhesives based on the ISO 16000 series standards. The research concerns three groups of construction adhesives with indoor applications, i.e., flooring (10), finishing walls and ceilings (6), and for other applications such as edge-gluing or gluing tiles or mirrors (9) differing in chemical composition. A series of temperature tests were carried out for a representative floor adhesive at selected temperatures: 25 °C, 35 °C and 45 °C. The theoretical correlation approach was adopted to characterise the relationship between the emission rate and temperature of selected chemical compounds.

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Adhesive bonding of textiles: principles, types of adhesive and methods of use

Cited by 19 publications

References 4 publications

Review on the Integration of Microelectronics for E-Textile

Review on the Integration of Microelectronics for E-Textile

Review on the Integration of Microelectronics for E-textile

Comparison of VOC Emissions Produced by Different Types of Adhesives Based on Test Chambers

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