2006 International Conference on Emerging Technologies 2006
DOI: 10.1109/icet.2006.335956
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Adhesive and Mechanical Properties of Nano-Particle Filled Thermoplastic Polyimide Dielectric Films for Microelectronics Packaging

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(2 citation statements)
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“…Polyimide samples prepared with silica nanoparticles showed that the thermal stability via thermogravimetric analysis (TGA) was improved with nanoparticles ). Aluminum nitride-filled nanocomposite polyimide was characterized as a dielectric material in microelectronic packaging (Saeed et al 2006). The mechanical properties, elastic modulus and strength, were improved with an increase in filler content.…”
Section: Opportunities For Enhanced High-temperature Dielectricsmentioning
confidence: 99%
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“…Polyimide samples prepared with silica nanoparticles showed that the thermal stability via thermogravimetric analysis (TGA) was improved with nanoparticles ). Aluminum nitride-filled nanocomposite polyimide was characterized as a dielectric material in microelectronic packaging (Saeed et al 2006). The mechanical properties, elastic modulus and strength, were improved with an increase in filler content.…”
Section: Opportunities For Enhanced High-temperature Dielectricsmentioning
confidence: 99%
“…A detailed analysis of electrical properties of polyimide nanocomposites as insulation for enameled wires and investigations of surface erosion under stress and partial discharge resistance showed that nano-filled polyimide have improved insulating properties (Saeed et al 2006). Anisotropic silicates were proposed to enhance the physical properties of polyimides .…”
Section: Opportunities For Enhanced High-temperature Dielectricsmentioning
confidence: 99%