2013
DOI: 10.1116/1.4827197
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Adhesion testing of atomic layer deposited TiO2 on glass substrate by the use of embedded SiO2 microspheres

Abstract: Articles you may be interested inIn this paper, the authors present a new adhesion test method, which is under development, to study the interfacial mechanical parameters of atomic layer deposited (ALD) thin films. A highly sensitive lateral force adhesion testing tool was used to measure the lateral detaching force of 8 lm diameter SiO 2 microspheres embedded in 100 nm ALD TiO 2 thin film grown in 200 C. The resulting holes in the coating were characterized with scanning electron microscope plus energy disper… Show more

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Cited by 7 publications
(4 citation statements)
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“…Mechanical studies on ALD films mostly concentrated on elastic modulus, hardness measurement, or residual stress and can be classified into work on single compound film materials, mainly oxides and nitrides, prepared on stiff substrates, like Si or glass [15,16,17,18,19,20,21,22,23,24,25,26] and Al 2 O 3 [27]. The mechanical properties of nanolaminates films have also been investigated on stiff substrates [19,28,29,30,31,32,33,34].…”
Section: Introductionmentioning
confidence: 99%
“…Mechanical studies on ALD films mostly concentrated on elastic modulus, hardness measurement, or residual stress and can be classified into work on single compound film materials, mainly oxides and nitrides, prepared on stiff substrates, like Si or glass [15,16,17,18,19,20,21,22,23,24,25,26] and Al 2 O 3 [27]. The mechanical properties of nanolaminates films have also been investigated on stiff substrates [19,28,29,30,31,32,33,34].…”
Section: Introductionmentioning
confidence: 99%
“…The lack of other oxides that strongly adhere to TiO 2 , such as Al 2 O 3 , which are present in borosilicate glass slides, might also facilitate the transfer. 62,63 Additionally, we used a lubricant layer to demonstrate the importance of reducing the interaction between TiO 2 NPs and their support to ease the transfer. Specifically, we coated the silicon wafers prior to the deposition of the loaded micelles with a carbon layer (<10 nm).…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…Other MEMS based techniques for characterizing the adhesion of thin films have been developed. These techniques include a MEMS shaft-loading blister testing system [41], embedding SiO 2 microspheres in thin films and calculating the critical stress required for detaching the microspheres [42], a magnetically actuated peel test system for thin films [43] and using the deflection of micro-cantilevers to evaluate interface fracture properties [44]. These MEMS based techniques are destructive techniques that require extensive sample preparation time, external systems for load application such as using a nanoindenter system or Atomic Force Microscope and characterization techniques to assess the damaged thin film structure.…”
Section: Introductionmentioning
confidence: 99%