2008
DOI: 10.1016/j.tsf.2008.05.033
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Adhesion strength measurement of polymer dielectric interfaces using laser spallation technique

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Cited by 44 publications
(31 citation statements)
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“…A significant number of laser spallation studies incorporate images of film failure by stress wave loading [24][25][26][27][28][29]. The sequence of images indicates an increase in spall size with each increment in laser fluence, however, this trend has not been previously quantified.…”
Section: Scale Bar Is 1 MMmentioning
confidence: 99%
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“…A significant number of laser spallation studies incorporate images of film failure by stress wave loading [24][25][26][27][28][29]. The sequence of images indicates an increase in spall size with each increment in laser fluence, however, this trend has not been previously quantified.…”
Section: Scale Bar Is 1 MMmentioning
confidence: 99%
“…The spallation region varies based on the laser loading fluence (energy per unit area), and the coating composition or growth conditions. For example, several authors [25][26][27][28][29] report a larger spall size at higher fluences when compared with the same coating loaded at lower fluences, though no systematic study has been presented. It has also been qualitatively shown that a loaded film with low adhesion strength would result in a larger spall size than that of a high adhesion strength film loaded at the same fluence.…”
Section: Introductionmentioning
confidence: 99%
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“…or 400 nm thickness and a silicon wafer (Kandula et al, 2008b). Stress wave propagation in this multilayer system was analyzed analytically and numerically, by neglecting the influence of the silicon nitride layer in the analysis.…”
Section: Si/si X N Y /Pbo Systemmentioning
confidence: 99%
“…In microelectronic devices this layer also protects the underlying integrated circuit structure from moisture and contamination. Kandula et al (2008) have shown that a thin Si x N y layer does not influence the wave propagation, and in turn the state of stress at the film interface. They have also found that the substrate surface roughness significantly affects the thin film interfacial strength.…”
Section: Specimen Geometrymentioning
confidence: 99%