Adhesion problems in deep-etch x-ray lithography caused by fluorescence radiation from the plating base

Pantenburg, F. J.; Chlebek, J.; El-Kholi, A.; Huber, H.-L.; Mohr, Jürgen; Oertel, H.; Schulz, Joachim

doi:10.1016/0167-9317(94)90142-2

Cited by 32 publications

(16 citation statements)

References 2 publications

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“…Note that these thicknesses are significantly smaller than those in Figure 4 because a dissolution rate of 0.1 pm/h at 21 "C corresponds to an interface dose of 1.2 kJ/cm3 for cross-linked PMMA (about 900 J/cm3 for linear PMMA). While such a dose seems extremely large in view of the work by Schmidt et al [8], it is nevertheless similar to the acceptable doses determined by Pantenburg et al for the exposure of thin 20 pm resists used in making masks [4]. Their values .…”

mentioning

confidence: 52%

“…Using theoretical and experimental means, Pantenburg et al demonstrated that doses in the resist adjacent to the substrate and the associated loss of features were strongly dependent on the x-ray critical energy when the substrate and absorber thickness are fixed [4] and that adhesion can be improved significantly by increasing absorber thickness [8]. Schmidt et al similarly demonstrated that adhesion depends strongly on the substrate material for fixed absorber thickness and fixed x-ray energy [5].…”

Section: Past Researchmentioning

confidence: 92%

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An aluminum resist substrate for microfabrication by LIGA.

Kelly¹,

Boehme²,

Hauck

et al. 2005

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mentioning

confidence: 52%

Section: Past Researchmentioning

confidence: 92%

An aluminum resist substrate for microfabrication by LIGA.

Kelly¹,

Boehme²,

Hauck

et al. 2005

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“…As described by Pantenburg et al [6], the adhesion can be greatly reduced by electrons and fluorescence photons that are created during the irradiation beneath the mask absorber. X-ray absorption by the metallic plating base results in substrate-generated photoelectrons being absorbed in the resist near the substrate.…”

Section: Introductionmentioning

confidence: 94%

Enhanced adhesion buffer layer for deep x-ray lithography using hard x rays

Carlo

Song

Mancini

1998

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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The first step in the fabrication of microstructures using deep x-ray lithography (DXRL) is the irradiation of an x-ray sensitive resist like polymethylmethacrylate (PMMA) by hard x rays. At the Advanced Photon Source, a dedicated beamline allows the proper exposure of very thick (several mm) resists. To fabricate electroformed metal microstructures with heights of several mm, a PMMA sheet is glued onto a metallic plating base. An important requirement is that the PMMA layer must adhere well to the plating base. The adhesion is greatly reduced by the penetration of even a small fraction of hard x rays through the mask absorber into the substrate. In this work we will show a novel technique to improve the adhesion of PMMA onto high-Z substrates for DXRL. Results of the improved adhesion are shown for different exposure/substrate conditions.

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“…Metal-coated silicon wafers are usually used as a primary substrate. The high conductivity of the metal layer makes the wafer suitable as an electroplating base, but the secondary radiation generated during the higher energy exposure of DXRL can lead to adhesion failure [1]. Adhesion buffer layers have been used to reduce adhesion failure [2], but they complicate processing and can be difficult to remove.…”

Section: Introductionmentioning

confidence: 99%

Microfabrication of freestanding metal structures released from graphite substrates

Makarova

Tang

Mancini

et al.

Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical

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A sacrificial layer is usually used to release electroformed microstructures. Because of the chemistry applied to the sacrificial layer, only a limited number of metals can be used for electroforming. A novel method to fabricate freestanding electroformed copper structures is presented. A graphite substrate allows the release of the metal part, by abrasive removal of the graphite after electroforming. Results on fabrication of high-aspect-ratio freestanding copper grids are presented; these can be used as x-ray collimator in medical imaging to reduce scattered radiation. This process has potential application to the fabrication of injection molds and microparts on pick-and-place carriers for microelectromechanical systems (MEMS).

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Adhesion problems in deep-etch x-ray lithography caused by fluorescence radiation from the plating base

Cited by 32 publications

References 2 publications

An aluminum resist substrate for microfabrication by LIGA.

An aluminum resist substrate for microfabrication by LIGA.

Enhanced adhesion buffer layer for deep x-ray lithography using hard x rays

Microfabrication of freestanding metal structures released from graphite substrates

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