Adhesion of polycrystalline diamond thin films on single-crystal silicon substrates

Gamlen, Carol; Case, Eldon D.; Reinhard, D.K.; Huang, Bor-Luen

doi:10.1063/1.105942

Cited by 18 publications

(3 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Using a CH 4 1 H 2 gas mixture (flow rate 100 sccm, deposition pressure 30 Torr), the films were synthesized by varying the methane flow rate (1.0-3.0%) and the thickness (,30 mm). Using a CH 4 1 H 2 gas mixture (flow rate 100 sccm, deposition pressure 30 Torr), the films were synthesized by varying the methane flow rate (1.0-3.0%) and the thickness (,30 mm).…”

Section: A Diamond Film Depositionmentioning

confidence: 99%

A study on the residual stress measurement methods on chemical vapor deposition diamond films

Kim

1998

J. Mater. Res.

View full text Add to dashboard Cite

Diamond films were deposited on the p-type Si substrate with the hot filament chemical vapor deposition (HFCVD). Residual stresses in the films were measured in air by the laser curvature, the x-ray diffraction (XRD) d fc 2 sin 2 c, and the Raman peak shift methods. All of the measuring methods showed similar behaviors of residual stress that changed from a compressive to a tensile stress with increasing the film thickness. However, values of residual stresses obtained through the Raman and XRD methods were 3-4 times higher than those of the curvature method. These discrepancies involved the setting of materials constants of CVD diamond film, and determination of a peak shifting on the XRD and Raman method. In order to elucidate the disparity, we measured a Young's moduli of diamond films by using the sonic resonance method. In doing so, the Raman and XRD peak shift were calibrated by bending diamond/Si beams with diamond films by a known amount, with stress levels known a priori from the beam theory, and by monitoring the peak shifts simultaneously. Results of each measuring method showed well coincidental behaviors of residual stresses which have the stress range from 20.5 GPa to 10.7 GPa, and an intrinsic stress was caused about 10.7 GPa with tensile stress.

show abstract

Section: A Diamond Film Depositionmentioning

confidence: 99%

A study on the residual stress measurement methods on chemical vapor deposition diamond films

Kim

1998

J. Mater. Res.

View full text Add to dashboard Cite

show abstract

“…A variety of sharp [30] and blunt [31] indenters have been used in model crack studies. The relative ease in controlling the load, loading time, and indentation location has led to Vickers indentation cracks [24,30,32] as crack growth models for studies of slow crack growth [24,32], thermal shock/thermal fatigue [33][34][35][36][37][38][39], thermally induced crack healing [38,[40][41][42][43][44], cracking/delamination in coatings [45][46][47][48], contact flaws introduced during processing or handling of brittle materials [48][49][50], and in vitro cell responses to microcracks in bioceramics [51,52].…”

Section: Introductionmentioning

confidence: 99%

Slow growth of microcracks in hydroxyapatite during aging

2012

View full text Add to dashboard Cite

Hydroxyapatite (Ca 10 (PO 4 ) 6 (OH) 2 or HA) is a brittle material that is subject to environmentally assisted slow crack growth. While most slow crack growth studies are carried out after aging, this study examines the slow growth of radial cracks induced by Vickers indentation in dense HA (94 % of theoretical density) during aging in ambient air, where the observed crack growth is consistent with a process in which residual stress drives crack growth. For indentation loads of 0.98, 1.96, 2.94, and 4.91 N, the average radial crack length increased exponentially with time for indentation loads of 0.98, 1.96, 2.94, and 4.91 N, with crack lengths saturating within 1 h following indentation. However, no radial crack growth was observed for 9.81 N loads. The load dependence of radial crack growth is proposed to be linked to the partitioning of residual strain energy by the lateral crack growth, which has not been reported in the literature.

show abstract

“…In addition, the cutting and drilling process exposes the PDC compact material to high stress and high temperatures environments, where PDC cutting edges with cobalt binders tend to produce microcracks and diamond particle falling/chipping when the stress is greater than the bonding strength of the diamond within the PDC compact, which greatly reduces the life of the PDC compact. The reason can be explained by the elastic modulus and thermal expansion coefficients between the cobalt metal binder and diamond not matching each other, which can lead to inconsistent volume changes between the diamond and binder in high stress and high temperature operating environments [16][17][18][19][20] . As a result, large stresses would be produced inside the PDC materials.…”

mentioning

confidence: 99%

Ultrastrong catalyst-free polycrystalline diamond

Zhan²,

et al. 2020

Sci Rep

View full text Add to dashboard Cite

Diamond is the hardest naturally occurring material found on earth but single crystal diamond is brittle due to the nature of catastrophic cleavage fracture. Polycrystalline diamond compact (PDC) materials are made by high pressure and high temperature (HPHT) technology. PDC materials have been widely used in several industries. Wear resistance is a key material property that has long been pursued for its valuable industrial applications. However, the inevitable use of catalysts introduced by the conventional manufacturing process significantly reduces their end-use performance and limits many of their potential applications. In this work, an ultra-strong catalyst-free polycrystalline diamond compact material has been successfully synthesized through innovative ultra-high pressure and ultra-high temperature (UHPHT) technology. These results set up new industry records for wear resistance and thermal stability for PDC cutters utilized for drilling in the oil and gas industry. The new material also broke all single-crystal diamond indenters, suggesting that the new material is too hard to be measured by the current standard single-crystal diamond indentation method. This represents a major breakthrough in hard materials that can expand many potential scientific research and industrial applications.

show abstract

Adhesion of polycrystalline diamond thin films on single-crystal silicon substrates

Cited by 18 publications

References 7 publications

A study on the residual stress measurement methods on chemical vapor deposition diamond films

A study on the residual stress measurement methods on chemical vapor deposition diamond films

Slow growth of microcracks in hydroxyapatite during aging

Ultrastrong catalyst-free polycrystalline diamond

Contact Info

Product

Resources

About