Adhesion integrity evaluation of plastic encapsulated semiconductor package

Kawamura, Noriyasu; Hirohata, Kenji; Kawakami, Takashi; Sawada, K.; Mino, T.; Kurosu, Atsushi; Takano, E.; Yeoul, Yoo Hee

doi:10.1109/ectc.1998.678858

Cited by 9 publications

(3 citation statements)

References 6 publications

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“…Also, the silicon content increases as the discharge pulse energy conditions become lower. In general, the adhesion force between epoxy resin and silicon is high 12), 13) . Therefore, epoxy resin has been used as the material for packaging of silicon IC chips.…”

Section: Chemical Factormentioning

confidence: 99%

Effect on Mold Releasability on EDM Finished Surface using Powder Mixed Working Fluid

Kitada

Fujii

Wang

et al. 2018

IJEM

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In this study, separation forces between molded epoxy resin and EDM finished surfaces were measured by using a tensile tester in order to quantitatively evaluate mold releasability. Based on the releasability test results, factors affecting the releasability of molded resin were discussed. Experimental results clarified that the separation force of molded epoxy resin from the EDM finished surface with kerosene type working fluid decreased with an increase of the surface roughness. The separation forces from the EDM finished surfaces with silicon powder mixed fluid and aluminum power one were higher than that with kerosene type working fluid. Furthermore, EDM finishing using nickel powder mixed fluid was tried to form thin surface layer containing nickel which would have high releasability. By using nickel powder mixed fluid, nickel could be included into the EDM finished surface, which led to lower separation force of molded resin.

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Section: Chemical Factormentioning

confidence: 99%

Effect on Mold Releasability on EDM Finished Surface using Powder Mixed Working Fluid

Kitada

Fujii

Wang

et al. 2018

IJEM

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“…Normally there are three kinds of interfacial adhesion tests, shear test, pull test and peel test This was to measure experimentally the apparent fracture toughness of interface of adhesive and metal substrate. Kawamura et. al.…”

Section: Strength Testsmentioning

confidence: 99%

“…(1998) Rokhlin (1986,1988) used lap shear specimen to measure the strength of the joint after ultrasonic monitoring of the adhesive curing. Kawamura et al (1998) reported that in order to measure the adhesion strength of the resin and silicon chip, fracture test under shearing load was carried out. Fahr (1990) reported to use tension load to fail the testspecimens in a universal testing machine and the failure load was measured.…”

Section: Strength Testsmentioning

confidence: 99%

Ultrasonic characterisation of interfaces in IC packaging

Wang¹

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There are many interfaces that exist in IC packaging, such as that between mold compound and silicon chip, and that between silicon die and copper lead-frame. The quality of the interface is becoming a critical issue in the reliability testing of IC packaging and during the manufacturing process as the packages become thinner and denser. Common defects such as delamination and crack can be detected using C-mode scanning acoustic microscope with sufficient confidence as ultrasonic reflection wave changes dramatically in the gross defects area. However, a weak interface due to weak adhesion and poor cohesion has often gone undetected as ultrasonic reflection wave only changes a bit in weak interface area, and weak interface may become potential defective area at a later stage. It is desirable to develop a more sensitive and quantitative method to Acknowledgement The author's most sincere gratitude is given to his supervisor Dr. Guo Ningqun for providing the topic, direction, advice and guidance throughout the project. His weekly discussions are most valuable to learning.

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