Adhesion between polycarbonate substrate and SiO2 film formed from silane and nitrous oxide by plasma-enhanced chemical vapor deposition

Abstract

We studied the adhesion of a silicon dioxide film, formed from silane and nitrous oxide gas by plasma-enhanced chemical vapor deposition, to a polycarbonate substrate and the bonding between the film and the substrate by x-ray photoelectron spectroscopy. Adhesion of the SiO2 film to the polycarbonate increases with increasing SiH4 flow rate. All SiO2 film squares produced at a SiH4 flow rate of 10 standard cm3 min−1 exhibited good adhesion to the substrate. An analysis of the x-ray photoelectron spectra indicates that more phenyl groups are decomposed as adhesion increases. The bonding between the SiO2 film and the polycarbonate substrate is discussed on the basis of x-ray photoelectron spectroscopy. The Si–O–C bonding between SiO2 and polycarbonate results in good adhesion between the film and the substrate.

TiO2 Coatings Via Atmospheric-Pressure Plasma-Enhanced Chemical Vapor Deposition for Enhancing the UV-Resistant Properties of Transparent Plastics

“…This can lead to the formation of polar groups that can improve the hydrogen and covalent bonds as well as the van der Waals interactions. It can also intensify the creation of chain ends that can enhance interdiffusion and induce a change in the surface topography, which, in turn, could improve the mechanical interlocking between the coatings and polymers. − …”

“…It can also intensify the creation of chain ends that can enhance interdiffusion and induce a change in the surface topography, which, in turn, could improve the mechanical interlocking between the coatings and polymers. 32 − 34 …”

Pre-grafted Group on PE Surface by DBD Plasma and Its Influence on the Oxygen Permeation with Coated SiOx

“…Additionally, as reported [ 41 , 42 ], when polymers were treated with a carbon-rich monomer, Si–O–C or Si–C groups were easily formed in the coatings, which could provide good adhesion between the SiO x layer and polymeric substrate based on the strong interfacial chemical bonding. There may be another reason for the fact that the cracks in Figure 2 a, the untreatment-coated SiOx, were serious.…”

Moisture Diffusion in PECVD a-SiOxNy:H and a-SiOx:H Coated on Polymer Resins: A Neutron Reflectometry Study

“…Free organic species may be incorporated at the onset of the dielectric deposition and result in a graded dielectric-polymer interface, as demonstrated by ellipsometry and X-ray photoelectron spectroscopy (XPS) for SiO 2 deposited on polycarbonate and polypropylene substrates. , The graded area is sometimes associated with weaker mechanical properties at the dielectric-resin interface . Understanding the polymeric resin degradation at the dielectric-resin interface and the effect of water absorption in the hard coating is critical to resolving existing challenges in integrated device performance.…”