1997
DOI: 10.1016/s0032-3861(96)01036-1
|View full text |Cite
|
Sign up to set email alerts
|

Adhesion behaviour of polyamic acid cured epoxy

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4

Citation Types

0
17
0

Year Published

2002
2002
2014
2014

Publication Types

Select...
9
1

Relationship

0
10

Authors

Journals

citations
Cited by 36 publications
(17 citation statements)
references
References 5 publications
0
17
0
Order By: Relevance
“…Generally, modifying epoxy resin with polyamides or imido compounds 2-3 provide a convenient approach of enhancing the thermal stability of epoxy resins. Therefore, epoxy resins were cured with reactive polyimides 2-4 , polyamic acid 5 , and imido-modified curing agents 6 to introduce imide structure into epoxy resin. The thermal stability of the above mentioned imido epoxy resins was significantly leveled up both in the initial decomposition temperature (IDT) and the integral procedural decomposition temperature (IPDT) 7 .…”
Section: Introductionmentioning
confidence: 99%
“…Generally, modifying epoxy resin with polyamides or imido compounds 2-3 provide a convenient approach of enhancing the thermal stability of epoxy resins. Therefore, epoxy resins were cured with reactive polyimides 2-4 , polyamic acid 5 , and imido-modified curing agents 6 to introduce imide structure into epoxy resin. The thermal stability of the above mentioned imido epoxy resins was significantly leveled up both in the initial decomposition temperature (IDT) and the integral procedural decomposition temperature (IPDT) 7 .…”
Section: Introductionmentioning
confidence: 99%
“…Generally, modifying epoxy resin with polyamides or imido compounds [3] provide a convenient approach of enhancing the thermal stability of epoxy resins. Therefore, epoxy resins were cured with reactive polyimides [4], polyamic acid [5], and imido-modified curing agents [6] to introduce imide structure into epoxy resin. The thermal stability of the above mentioned imido epoxy resins was significantly levelled up both in the initial decomposition temperature (IDT) and the integral procedural decomposition temperature (IPDT) [7].…”
Section: Introductionmentioning
confidence: 99%
“…Generally, modifying epoxy resin with polyamides or imido compounds [2][3] provides a convenient approach of enhancing the thermal stability of epoxy resins. Therefore, epoxy resins were cured with reactive polyimides, [2][3][4] polyamic acid, 5 and imidomodified curing agents 6 to introduce imide structure into epoxy resin. The thermal stability of the above mentioned imido epoxy resins was significantly leveled up both in the initial decomposition temperature (IDT) and the integral procedural decomposition temperature (IPDT).…”
Section: Introductionmentioning
confidence: 99%