1992
DOI: 10.1080/00218469208026535
|View full text |Cite
|
Sign up to set email alerts
|

Adhesion Behavior of Thermoplastic Polyimides and Poly(imide-siloxane) Segmented Copolymers: Influence of Test Temperatures

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
16
0
1

Year Published

1994
1994
2019
2019

Publication Types

Select...
8
1

Relationship

0
9

Authors

Journals

citations
Cited by 25 publications
(17 citation statements)
references
References 11 publications
0
16
0
1
Order By: Relevance
“…The adhesion test was evaluated by the shear adhesive strength of copper plates through the polyimide films heated at 400 o C. The polyimides film was placed between copper plates and heated at 400 o C for 10 minutes, then cooled to room temperature. Since the plates were adhered through the polyimide, the shear adhesive strength was measured according to JIST 6850 [15,16] and the results are shown in Table 3. PI-PMDA and PI-m (m = 0-1) exhibited shear adhesive strengths of more than 50 MPa, and those of PI-2, PI-3, and PI-4 were lower with increasing m, reflecting the E' at 400 o C. No adhesion properties were in the previous polyimides from other diamines [1-3], suggesting that PI-PMDA and PI-m (m = 0-4) showed such adhesion properties due to their five rotational ether linkages in the diamine unit.…”
Section: Polymer Propertiesmentioning
confidence: 99%
“…The adhesion test was evaluated by the shear adhesive strength of copper plates through the polyimide films heated at 400 o C. The polyimides film was placed between copper plates and heated at 400 o C for 10 minutes, then cooled to room temperature. Since the plates were adhered through the polyimide, the shear adhesive strength was measured according to JIST 6850 [15,16] and the results are shown in Table 3. PI-PMDA and PI-m (m = 0-1) exhibited shear adhesive strengths of more than 50 MPa, and those of PI-2, PI-3, and PI-4 were lower with increasing m, reflecting the E' at 400 o C. No adhesion properties were in the previous polyimides from other diamines [1-3], suggesting that PI-PMDA and PI-m (m = 0-4) showed such adhesion properties due to their five rotational ether linkages in the diamine unit.…”
Section: Polymer Propertiesmentioning
confidence: 99%
“…A highly ductile adhesive is often a weak material and can only sustain minimal loads. Studies with different adhesive chemistries and hybrid designs that use separated segments of stiff and flexible glues along the bondline have shown that ductility does influence joint strength, yet the optimum balance between strength and ductility often remains unclear.…”
Section: Introductionmentioning
confidence: 99%
“…Dissolution into a solvent is needed to flow between substrates and interact with surfaces. A primary means of curing here is likely to be loss of the solvent. , Catechol oxidation and subsequent cross-linking may also be relevant curing processes. , From our previous studies, it appears that cure time and temperature can be traded, with higher temperatures requiring shorter cure times and lower temperatures needing longer cure times . Another potential effect here is that lower cure temperatures may results in solvent persisting and an increase in ductility, whereas higher temperatures, above the boiling point of the solvent, generally result in higher strength but brittle polymers …”
Section: Resultsmentioning
confidence: 99%