Handbook of Physical Vapor Deposition (PVD) Processing 1998
DOI: 10.1016/b978-081551422-0.50012-7
|View full text |Cite
|
Sign up to set email alerts
|

Adhesion and Deadhesion

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
9
0

Year Published

2009
2009
2023
2023

Publication Types

Select...
7
1

Relationship

0
8

Authors

Journals

citations
Cited by 11 publications
(11 citation statements)
references
References 137 publications
0
9
0
Order By: Relevance
“…The sputtering yield partially depends on the mass ratio between the incident ions and the target material. Increasing the ion mass can lead to a lower sputtering yield for light elements, while it can lead to a higher yield for heavy elements [ 27 ]. Meanwhile, sputtering with heavier ions may reduce the deposition probability since the thermalization distance also depends on the mass ratio between the gas atom and the target material [ 1 ], despite the lower sputtering pressure.…”
Section: Resultsmentioning
confidence: 99%
“…The sputtering yield partially depends on the mass ratio between the incident ions and the target material. Increasing the ion mass can lead to a lower sputtering yield for light elements, while it can lead to a higher yield for heavy elements [ 27 ]. Meanwhile, sputtering with heavier ions may reduce the deposition probability since the thermalization distance also depends on the mass ratio between the gas atom and the target material [ 1 ], despite the lower sputtering pressure.…”
Section: Resultsmentioning
confidence: 99%
“…Columnar layer growth is typical in deposition using the PVD method [ 23 , 24 , 25 , 26 , 27 , 28 , 29 ]. This mode occurs because the vaporized adatom particles do not necessarily interact with the substrate surface uniformly and evenly.…”
Section: Discussionmentioning
confidence: 99%
“…While the thinness of the catalyst caps prevents the structural characterization of TiO 2 with XRD techniques, HR-SEM and TEM identify the catalyst as “XRD amorphous” TiO 2 . The described methodology can be extended to other catalysts that can be deposited by PVD , geometries accessible to colloidal assembly , and types of polymers that can be infiltrated and cured .…”
Section: Discussionmentioning
confidence: 99%