Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules

Karas, Joseph; Michaelson, Lynne; Castillo, Mariela Lizet; Munoz, Krystal; Bailly, Mark; Jain, Harsh; Akey, Austin; Rand, J.A.; Tyson, Tom; Buonassisi, Tonio; Bowden, Stuart

doi:10.1109/pvsc.2016.7749739

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2020

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“…Furthermore, the EL images do not show signs of R S increase or contact detachment via weak adhesion, which is a common concern in Cu‐plated cells. Therefore we do not believe weak Cu‐contact adhesion is a contributing factor in these samples (which we previously observed to have similar adhesion to Ag‐screenprinted contacts 33 …”

Section: Resultsmentioning

confidence: 68%

Degradation of copper‐plated silicon solar cells with damp heat stress

Karas

Michaelson²,

Munoz³

et al. 2020

Progress in Photovoltaics

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Crystalline silicon solar cells with copper-plated contacts are fabricated, encapsulated in ethylene-vinyl acetate (EVA), and subject to extended damp heat stress (85 C and 85% relative humidity). We source cell precursors from several different cell manufacturers and employ several different patterning methods of the silicon nitride layer and deposit a plated front contact stack of nickel, copper, and tin using light-induced plating. Across different Cu-plated samples, we find similar degradation that impacts

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Section: Resultsmentioning

confidence: 68%