complicated, time and energy-consuming, relatively expensive, and produce a large amount of waste materials (washingcleaning-disposal requirements). [8] Thus, much effort has been put toward inventing new techniques for direct printing and additive manufacturing of electronics on desired flexible and rigid substrates, [9][10][11][12][13][14][15][16][17][18] such as polyimide and polyethylene terephthalate (PET). [19][20][21] Different fabrication strategies have been proposed for additive nanomanufacturing of electronics. [22][23][24][25][26][27] The most common direct-write technologies in the field of printed electronics are inkjet printing (IJP) and aerosol jet printing (AJP). [6,[28][29][30][31][32] These technologies allow the precise deposition of liquids containing functional materials. Recently, Patil et al. printed silver (Ag) nanowires (resistance < 50 Ω sq −1 ) on flexible substrates via inkjet printing. [33] Gilshtein et al. demonstrated inkjet-printed indium tin oxide (ITO) patterns with a resistivity of 3.1 × 10 −3 Ω cm on soda-lime glass. [34] Chen et al. showed aerosol jet printing of Ag with a sheet resistance of 1.13 × 10 −2 Ω m −2 on cellulose fiber paper substrate. [31] However, the current ink formulations used in IJP and AJP processes make device fabrication more complicated because they require toxic solvents and additives that limit the substrate's compatibility and hinder the device's performance. [35,36] Also, nozzle clogging in IJP is a common and extremely complex phenomenon. [37] Furthermore, to guarantee a high conductivity of the printed structures, AJP usually requires a high sintering temperature (e.g., ≈280 °C) and a long sintering time (e.g., 12 h on a glass substrate). This limits the AJP to only a few types of substrates. [31] As a result, a new direct printing and patterning method is needed to overcome the challenges. Moreover, the new printing and patterning methods also need to be capable of printing structures with good reliability under repeated mechanical bending and unbending processes.Motivated by these challenges, here, we demonstrated a novel additive nanomanufacturing (ANM) technique recently developed in our lab for manufacturing FHEs and sensors by printing conductive Ag and ITO on different flexible platforms such as polyimide and PET substrates. Conductive Ag is typically used to print electronic tracks, electrodes and antennas. [38,39] Transparent conductors such as ITO are utilized in the printing of components such as flexible strain sensors, solar cells, and organic light-emitting diodes (OLEDs). [40][41][42][43] The growing demand for flexible and wearable hybrid electronics has triggered the need for advanced manufacturing techniques with versatile printing capabilities. Complex ink formulations, use of surfactants/contaminants, limited source materials, and the need for high-temperature heat treatments for sintering are major issues facing the current inkjet and aerosol printing methods. Here, the nanomanufacturing of flexible hybrid electronics (FHE) by...