Addition polyimide adhesives containing ATBN and silicone elastomers

Clair, A. K. Saint; Clair, T. L. Saint

doi:10.1016/0143-7496(81)90073-7

Cited by 21 publications

(3 citation statements)

References 3 publications

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“…However, their main drawbacks are brittleness and proclivity to microcrack under stresses in cross-ply composites . Therefore, many approaches have been reported in the literature to address these problems: (i) chain extension via Michael addition or cycloaddition reactions (ene and Diels−Alder reactions) with amine-terminated oligomers and thermoplastics, diallyl compounds, or bis(benzocyclobutene) compounds; (ii) reactive liquid rubbers; − (iii) thermoplastics powders; (iv) engineering thermoplastics and their derivatives (with reactive pendants or end groups); (v) hyperbranched aliphatic polyester . The challenge of all of these approaches is to inhibit microcracking while maintaining high-temperature utility.…”

Section: Resultsmentioning

confidence: 99%

A New Hyperbranched Poly(arylene−ether−ketone−imide): Synthesis, Chain-End Functionalization, and Blending with a Bis(maleimide)

et al. 2002

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While aromatic polyimides have found widespread use as high-performance polymers, the present work addressed the need for organosoluble pre-imidized materials through the use of a hyperbranching scheme. The AB 2 monomer, N- [3,5-bis(4-hydroxybenzoyl)benzene]-4-fluorophthalimide, was prepared from 4-fluoroisophthalic anhydride and 3,5-bis(4-hydroxybenzoyl)aniline. The latter was synthesized in three steps starting from commercially available 5-nitroisophthalic acid. The AB2 monomer was then polymerized via aromatic fluoride-displacement reaction to afford the corresponding hydroxylterminated hyperbranched polymer, HT-PAEKI, which was then functionalized with allyl and propargyl bromides as well as epichlorohydrin to afford allyl-terminated AT-PAEKI, propargyl-terminated PT-PAEKI, and epoxy (glycidyl)-terminated ET-PAEKI, in that order. All hyperbranched poly(ether-ketoneimide)s were soluble in common organic solvents. Intrinsic viscosities of HT-, AT-, PT-, and ET-PAEKI in NMP were 0.13, 0.08, 0.08, and 0.08 dL/g, in that order. AT-PAEKI displayed an exotherm due to Claisen rearrangement at 269 °C and allyl-based thermal-cure reaction at 343 °C. PT-PAEKI displayed only a single, strong exotherm at 278 °C. Because of hydrogen bonding, HT-PAEKI displayed T g of 224 °C while its derivatives exhibited lower Tg values ranging from 122 to 174 °C. Finally, AT-PAEKI was blended with a bisphenol A-based bis(maleimide) (BPA-BMI) in various weight ratios. The results from differential scanning calorimetric study indicated that the presence of AT-PAEKI (up to 32 wt %) significantly affect the glass transition temperatures and cure behavior of BPA-BMI. Dynamic mechanical analysis comparing cured BPA-BMI with the 5 wt % AT-PAEKI blend corroborates this increase in glass transition temperature.

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Section: Resultsmentioning

confidence: 99%

A New Hyperbranched Poly(arylene−ether−ketone−imide): Synthesis, Chain-End Functionalization, and Blending with a Bis(maleimide)

et al. 2002

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“…To overcome the reduction in thermal stability observed with the use of a traditional hydrocarbon rubber toughener, we explored silicone rubbers as a class of alternative, thermally stable toughening additives. Several studies in the literature have shown that silicone elastomers can be used to improve the toughness of high‐performance epoxies30–33 and polyimides 34–36. To this end, we evaluated a range of different silicone resins with vinyl, methacrylate, or benzylidene cyanoacetate functional endgroups or sidegroups as thermally stable toughening additives for the polyester resins.…”

Section: Resultsmentioning

confidence: 99%

Properties and toughening of heat‐resistant thermosets based on unsaturated ester resins

Canelas

Abbey

Fentress

2002

J of Applied Polymer Sci

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ABSTRACT:We describe our investigations of the curing chemistry and properties of heat-resistant thermosets comprised of unsaturated ester resins. We suggest a mechanism for the rearrangement of the cured matrix and volatile evolution during the curing process. We employed dielectric spectroscopy (DES) as a tool for monitoring the extent of cure, determining glass-transition temperatures, and evaluating electrical properties of the resins. We compare and contrast results obtained by DES to results obtained by dynamic mechanical analysis (DMA). Fracture testing showed that improvements were made in the toughness of these materials by blending the uncured resin with impact modifiers such as hydrocarbon or silicone reactive rubber adducts or poly(arylene ether sulfone)-based thermoplastic oligomers. We determined the effects of the thermoplastic toughening additive's molecular weight, concentration, and endgroup functionality on the phase separation, thermal stability, and fracture toughness of the blend.

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“…18–20 In addition, polyimide adhesive films have attracted the interest of polymer chemists because of their advantages in large-area bonding and convenience in application. 21–23 In recent years, various thermoplastic polyimides and copolyimides have been developed and applied as film adhesives, including some in self-supported and glass-cloth-supported forms. 24–27…”

Section: Introductionmentioning

confidence: 99%

Synthesis of phthalic end-capped copolyimides and their adhesive properties

Huo

Song

Sun

et al. 2011

High Performance Polymers

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A series of molecular-weight-controlled aromatic copolyimides based on anhydrides 4,4 0 -oxydiphthalic anhydride (ODPA) or/ and 2,3,3 0 ,4 0 -biphenyltetracarboxylic dianhydride (a-BPDA) were prepared by polycondensation reaction with mixture of diamines 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (6FAPB) and 4,4 0 -diaminodiphenylsulphone (DDS) in the presence of phthalic anhydride (PA) as end-capping agent. The effect of the chemical structure of the copolyimides on solubility, rheological behavior, thermal stabilities and adhesive properties was investigated. Experimental results suggested that the solubility and thermal properties of copolyimides could be improved by incorporation of asymmetric a-BPDA. The copolyimide TPI-B (a-BPDA/6FAPB-DDS/PA) exhibited better solubility with the solid content as high as 45 wt.% in N,N-dimethylacetamide and high thermal stability with the T g of 306 C. TPI-A (ODPA/6FAPB-DDS/PA) and TPI-C (a-BPDA-ODPA/6FAPB-DDS/PA) could be produced into glass-cloth-supported adhesive films. TPI-A adhesive film gave better adhesive properties at room temperature with lap shear strength of 16.41 MPa and T-peel strength of 2.1 kN m À1 , which attributed to its flexible structure and good melt processability. TPI-C adhesive film exhibited higher adhesive properties at elevated temperature with the lap shear strength exceeding 9 MPa at 280 C. The copolyimides with combination of rigid and flexible structures could afford good melt flow behavior and high thermal stability, which yielded good adhesive properties at high temperature.

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Addition polyimide adhesives containing ATBN and silicone elastomers

Cited by 21 publications

References 3 publications

A New Hyperbranched Poly(arylene−ether−ketone−imide): Synthesis, Chain-End Functionalization, and Blending with a Bis(maleimide)

A New Hyperbranched Poly(arylene−ether−ketone−imide): Synthesis, Chain-End Functionalization, and Blending with a Bis(maleimide)

Properties and toughening of heat‐resistant thermosets based on unsaturated ester resins

Synthesis of phthalic end-capped copolyimides and their adhesive properties

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