Adapter molding and heat transfer analysis

Abstract

In this paper, we investigated the excessive thermal stress caused by the difference in the coefficient of thermal expansion of the material during the molding process of the adapter. It has led to the bulging phenomenon during the high and low-temperature tests. We analyzed the heat transfer mechanism of the adapter during the high and low-temperature tests by using finite element simulation. We then analyzed the causes of the bulging phenomenon. We successfully solved the bulging problem by using the method of heating up the foamed adapter together with the mold for curing, which provided a new idea for adapter molding.