2004
DOI: 10.1149/1.1737384
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Activity of SiC Particles in Al-Based Metal Matrix Composites Revealed by SECM

Abstract: Scanning electrochemical microscopy ͑SECM͒ is used to image variations in electrochemical activity over the surface of an aluminum-based metal matrix composite ͑MMC͒ in contact with buffered or unbuffered neutral solutions. The composite consists of an Al-13.5% Si-9% Mg alloy matrix and reinforcing silicon carbide particles (SiC p ). Feedback-mode SECM imaging using ferrocenemethanol as a redox mediator in 0.1 M NaCl solution and in buffer solution ͑pH 6.8͒ revealed that the SiC particles are electrochemically… Show more

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Cited by 21 publications
(17 citation statements)
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“…This corrosion occurred during the SECM imaging experiment while immersed in the boric acid-borax buffer and highlights susceptibility of this surface to corrosion. These results are all in agreement with the previous study [34].…”
Section: Applications Of the Pocf To Secm Measurementssupporting
confidence: 94%
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“…This corrosion occurred during the SECM imaging experiment while immersed in the boric acid-borax buffer and highlights susceptibility of this surface to corrosion. These results are all in agreement with the previous study [34].…”
Section: Applications Of the Pocf To Secm Measurementssupporting
confidence: 94%
“…Unfortunately, these materials are susceptible to corrosion, likely due to galvanic coupling between the aluminum matrix and the semiconducting SiC particles [48 -51]. In our report, we demonstrate that SiC particles in Al/SiC p composite samples are conductive and act as local cathodes for the oxygen reduction in water as well as in NaCl and borate solutions [34]. Figure 11A shows an optical micrograph of an Al/SiC p composite.…”
Section: Applications Of the Pocf To Secm Measurementsmentioning
confidence: 50%
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“…The SECM is an effective ''in situ'' method for the investigation of coated or uncoated metals [51][52][53][54][55][56]. Here, SECM feedback mode is employed to monitor the swelling of epoxy coating by measuring the tip-substrate distance which is derived from the decreased feedback current with the assistance of approach curve [57,58].…”
Section: Secmmentioning
confidence: 99%