2021
DOI: 10.35848/1347-4065/ac00fe
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Active pixel sensor readout circuit using indium–tin–zinc-oxide thin-film transistors for image sensor applications

Abstract: In this study, we describe an active pixel sensor (APS) readout circuit using indium–tin–zinc-oxide (ITZO) thin-film transistors (TFTs). The APS readout circuit with a pixel size of 90 μm was fabricated using ITZO TFTs with a channel length of 2 μm, and its performance was experimentally evaluated. The ITZO TFTs were found to have good low-frequency noise performance with an extracted Hooge’s parameter (α H) of 3.5 × 10−3, and the APS exhibits a high DC voltage gain of ∼0.81 with satisfactory… Show more

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Cited by 4 publications
(4 citation statements)
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References 32 publications
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“…The layout of the APS pixel shown in Fig. 1(c) was designed with a size of 50 × 50 μm 2 , which is smaller than that in our previous study (90 × 90 μm 2 ) 27) and was achieved using more narrow wirings with a width of 2.5 μm. The TFTs used had a channel width of 10 μm and a channel length of 2 μm and are the same size as that in our previous study.…”
Section: Aps Pixel Architecturementioning
confidence: 99%
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“…The layout of the APS pixel shown in Fig. 1(c) was designed with a size of 50 × 50 μm 2 , which is smaller than that in our previous study (90 × 90 μm 2 ) 27) and was achieved using more narrow wirings with a width of 2.5 μm. The TFTs used had a channel width of 10 μm and a channel length of 2 μm and are the same size as that in our previous study.…”
Section: Aps Pixel Architecturementioning
confidence: 99%
“…The TFT circuits in the APS were fabricated by the following procedure including the same TFT fabrication processes as reported in the previous literature. 27) A 50 nm thick Mo alloy was deposited on a glass substrate by DC magnetron sputtering to form gate electrodes, and a 200 nm thick silicon oxide was deposited by sputtering as a gate insulator. A 50 nm thick indium-tinoxide (ITO) was then deposited by DC magnetron sputtering to form pixel electrodes, and a 30 nm thick ITZO semiconductor layer was deposited by sputtering and patterned.…”
Section: Fabrication Of the Apsmentioning
confidence: 99%
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