The largeâarea lowâtemperature processing capability and versatile characteristics of amorphous oxide semiconductor (AOS) thinâfilm transistors (TFTs) are highly expected to promote the developments of nextâgeneration displays, 3D integrated circuit (3DIC), flexible chips, and electronics. However, the abundant native defects in AOSs engrain an inherent tradeâoff between high mobility and trustworthy stability in AOS TFTs, fundamentally limiting the performance metrics and integration scale of oxideâbased electronics. To surmount this obstacle, the bilayer AOS channel is highly expected to combine the merits of diversified AOSs, while the efficiency of such an AOS âheterojunctionâ is debatable. This work systematically compares the TFTs based on amorphous InGaZnO (aâIGZO), amorphous InZnO (aâIZO), and aâIZO/aâIGZO bilayer. The active cation interaction between metalâoxide semiconductors gives rise to a mixed AOS layer rather than a heterojunction channel, corresponding to moderate performance metrics. Such a spontaneous cation interdiffusion is effectively prevented using a dense metalâoxide dielectric interlayer, aluminum oxide (AlOx). The sharpened interface effectively forms an abrupt metalâoxide heterojunction, while the electron can still tunnel through the ultrathin AlOx to create a quantum well of 2D electron gas (2DEG). The overall performance and reliability of multilayer AOS TFT are synergistically enhanced using the proposed abrupt metalâoxide heterojunction architecture.