Active interposer technology for high-speed and low-cost chip-to-chip optical interconnects

Abstract

We have developed opto-electronic conversion module termed " active interposer" and polymeric waveguide film lamination technologies for optical interconnects between LSI chips.The fabricated active interposers are composed of VCSELs, MSM-PDs , submount and composed of Si circuits stacked via through-hole electrodes enabling high-performances. Also, waveguide film lamination technologies developed are capable of cost reductions. We present processing and test results of the fabricated optoelectronic devices suitable for 3D stacking as well as the high-speed transmission characteristics of the active interposers assembled on the PCB where polymeric waveguide film is lammated.