Active Cooling Using Fluid Channels in a Silicon-Ceramic Composite Substrate

Fischer, M.; Werthes, T.; Kleinholz, C.; Müller, Jens

doi:10.23919/empc44848.2019.8951844

2019 22nd European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC) 2019

DOI: 10.23919/empc44848.2019.8951844

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Active Cooling Using Fluid Channels in a Silicon-Ceramic Composite Substrate

M. Fischer

T. Werthes

C. Kleinholz

et al.

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Active Cooling Using Fluid Channels in a Silicon-Ceramic Composite Substrate

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References 6 publications

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