Active cooling performance of a PCM-based thermoelectric device: Dynamic characteristics and parametric investigations

Cai, Yang; Hong, Bing-Hua; Wu, Weixiong; Wang, Weiwei; Zhao, Fu-Yun

doi:10.1016/j.energy.2022.124356

Cited by 22 publications

(3 citation statements)

References 45 publications

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“…increase, their performance increasingly depends on efficient thermal management 1 . However, conventional cooling systems based on compression or caloric effects are not suitable for microsystems, due to their large volume or extreme operation conditions 2 , 3 . Thermoelectric coolers (TECs) based on the Peltier effect provide an alternative technology directly generating local cooling by electricity, which has many advantages such as no moving parts, no noise, lightweight, and long service life 1 , 2 , 4 .…”

Section: Introductionmentioning

confidence: 99%

General strategy for developing thick-film micro-thermoelectric coolers from material fabrication to device integration

Sun,

Yan,

Kang

et al. 2024

Nat Commun

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Micro-thermoelectric coolers are emerging as a promising solution for high-density cooling applications in confined spaces. Unlike thin-film micro-thermoelectric coolers with high cooling flux at the expense of cooling temperature difference due to very short thermoelectric legs, thick-film micro-thermoelectric coolers can achieve better comprehensive cooling performance. However, they still face significant challenges in both material preparation and device integration. Herein, we propose a design strategy which combines Bi2Te3-based thick film prepared by powder direct molding with micro-thermoelectric cooler integrated via phase-change batch transfer. Accurate thickness control and relatively high thermoelectric performance can be achieved for the thick film, and the high-density-integrated thick-film micro-thermoelectric cooler exhibits excellent performance with maximum cooling temperature difference of 40.6 K and maximum cooling flux of 56.5 W·cm−2 at room temperature. The micro-thermoelectric cooler also shows high temperature control accuracy (0.01 K) and reliability (over 30000 cooling cycles). Moreover, the device demonstrates remarkable capacity in power generation with normalized power density up to 214.0 μW · cm−2 · K−2. This study provides a general and scalable route for developing high-performance thick-film micro-thermoelectric cooler, benefiting widespread applications in thermal management of microsystems.

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Section: Introductionmentioning

confidence: 99%

General strategy for developing thick-film micro-thermoelectric coolers from material fabrication to device integration

Sun,

Yan,

Kang

et al. 2024

Nat Commun

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“…Further studies are aimed at revealing the analytical relationship of reliability indicators with structural [11], mechanical parameters [12], and manufacturing technology [13], and energy effects [14]. The issues of TEC dynamics are considered in [15,16]. However, these works did not consider the issues of TEC dynamics, which are important for the cooler-regulator complex.…”

Section: Introductionmentioning

confidence: 99%

Method of reliability control of thermoelectric systems to ensure thermal regimes

Zaykov,

Mescheryakov,

Ustenko

2024

HAIT

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The paper presents the results of research of controllability of the thermoelectric system for ensuring thermal modes of electronic equipment, including a regulator, a cooler, and a component of excess heat removal to the environment. It is shown that for the use of methods of optimization of automatic control systems it is necessary to study the transfer and dynamic characteristics of the object - thermoelectric cooling device with one input and one output. The mathematical model of the thermoelectric cooler of the system of providing thermal modes of a given design is presented, which takes into account the influence of the conditions of interaction of the heat sink with the medium on the main significant parameters, reliability indicators, dynamic and energy characteristics of the single stage cooler. The model is created for the operating range of cooling, level of thermal load, geometry of thermocouple branches, different temperature of the medium, for the characteristic thermal regime of maximum cooling capacity. The results of calculations of the main significant parameters, reliability indicators, dynamic and energy characteristics of the cooler for different medium temperature in the operating temperature range and variation of conditions of heat exchange of the heat sink with the medium are given. It is shown that as the intensity of heat exchange of the heat sink with the medium increases, the temperature difference between the heat sink and the medium decreases. This makes it possible to significantly reduce the relative failure rate, increase the probability of failure-free operation of the thermoelectric cooler and control the reliability indicators of the device of a given design during operation.

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“…Results show that the optimized ETCC reaches about 58 W/$ in case of part load utilized power while ETCC increases to 0.64 W/$ if the cooling power load increases by 30%. The increasing the performance of hybrid systems integrated with TEC is investigated by different research groups (e.g., using the phase change materials (PCM) as a cooling medium in the hot side [9][10][11][12] while others used the nano-fluid as an additive material for the cooling medium [13][14][15]). While other researchers focus on theoretical modeling and study the parameters that contribute in the increasing of performance [4 and 16].…”

Section: Introductionmentioning

confidence: 99%

Assessment of Thermal Performance of Non-Evaporative Cooling System Assisted with TEC Models at High Temperature Climate

Jabbar

Al-Tayyar

Mansoor

et al. 2023

AMM

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In this work, a non-evaporative cooling system is used with an assisted thermoelectric cooler (TEC) devices module. The system was proposed as an alternative cooling system in the high temperature climate to overcome the high energy consumption of traditional air-conditioning compression cycle. The open source Open FOAM V.9 was used to solve the transient effect of 3D model of indirect non-evaporative cooling system. The primary air temperature was set to 319 . While, the air flow was tested under four different air inlet velocities: 0.75 m/s, 1 m/s, 1.25 m/s, and 1.5 m/s. the validation shows good and acceptable agreement in COP values of the system with both experimental and theoretical works from literature within an error between (12.9 % and 9.5 %). Results show that the temperate difference value on a slice through the length of the air channel starts to decrease as velocity increasing. For example, at the last timesteps of each velocity, the temperature difference reaches about (~10 oK) when velocity is (0.75 m/s) starting from the first quarter of the channel, while the same difference in temperature not reached until the half way of the channel from the channel inlet when velocity is (1.5 m/s). Revealing that even though the percentage increase in the velocity is about 50%, the change in the temperature difference value between the inlet and outlet of the channel is about 1.2%. The local Nusselt number shows that steady state heat transfer reached very quickly as the velocity increased (i.e., at 0.75 m/s at 12s while for 1.5 m/s at 4s). Notwithstanding, as the time processed the ( increases for all cases but becomes lower as the velocity increased. .

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Active cooling performance of a PCM-based thermoelectric device: Dynamic characteristics and parametric investigations

Cited by 22 publications

References 45 publications

General strategy for developing thick-film micro-thermoelectric coolers from material fabrication to device integration

General strategy for developing thick-film micro-thermoelectric coolers from material fabrication to device integration

Method of reliability control of thermoelectric systems to ensure thermal regimes

Assessment of Thermal Performance of Non-Evaporative Cooling System Assisted with TEC Models at High Temperature Climate

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