Acoustic emission monitoring during laser shock cleaning of silicon wafers

Kim, T.; Lee, J.M.; Cho, S.H.; Kim, T.H.

doi:10.1016/j.optlaseng.2004.07.004

Cited by 21 publications

(5 citation statements)

References 4 publications

(7 reference statements)

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“…According to Lu and Aoyagi (1995), the creation of a plasma beam is accompanied by the generation of a shock wave and acoustic waves that are detectable by a simple microphone. For certain applications, the difference between the signal from a plasma beam ablation a coating of paint and that from the clean surface is sufficiently great to form a method for characterising the clean state of a surface (Kim et al, 2005). It is this acoustic signal analysis principle that has been chosen as a basis for a real-time slaving control of the process.…”

Section: Aimsmentioning

confidence: 99%

Optimisation of a paint coating ablation process by CO2 TEA laser: Thermal field modelling and real-time monitoring of the process

Coutouly

Deprez

Breabăn

et al. 2009

Journal of Materials Processing Technology

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Section: Aimsmentioning

confidence: 99%

Optimisation of a paint coating ablation process by CO2 TEA laser: Thermal field modelling and real-time monitoring of the process

Coutouly

Deprez

Breabăn

et al. 2009

Journal of Materials Processing Technology

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“…Laser in Ar gas produces stronger acoustic waves and higher cleaning efficiency. 18) Y. F. Lu et al investigated the generation of acoustic waves during the interaction of excimer lasers with materials such as Al, Si, and Cu. 19) W. Zou et al found that acoustic waves' frequency-amplitude spectrum can predict the laser paint removal threshold.…”

Section: Introductionmentioning

confidence: 99%

Simulation and experimental study of the evolution of shock waves during laser paint removal

Li,

Dong

et al. 2024

Jpn. J. Appl. Phys.

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This paper studies the spatiotemporal evolution of shock waves during laser paint removal. In order to study the evolution process of laser-induced plasma shock waves, we developed a laser-plasma shock wave evolution model based on the mass, momentum, and energy conservation theory. The evolution process of laser-induced plasma is studied by simulation and experiment. The simulation and experimental results show that the simulation model can accurately simulate the evolution of the plasma shock wave. In addition, by comparing the ablation depth and paint film thickness, we found that stripping is the primary mechanism of nanosecond pulsed laser paint removal. The ablation is the secondary paint removal mechanism. In summary, this study provides a new way of studying the evolution process of acoustic waves during laser removal paint.

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“…During laser cleaning technology, which uses the characteristics of the stain with strong laser absorption, stains instantaneous absorb a large amount of laser energy, forcing the separation of surface stains and silicon substrate. In the RCA cleaning method, silicon wafers are sequentially placed in a chemical reagent, such as a mixture of H 2 SO 4 and H 2 O 2 , HF, a combination of NH [22][23][24][25]. These cleaning methods have good effects, but the cleaning equipment is expensive.…”

Section: Introductionmentioning

confidence: 99%

Effect of Silicon Wafer Surface Stains on Copper-Assisted Chemical Etching

Chen

Tang

et al. 2023

Metals

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Silicon wafer slicing is a crucial process during solar cell fabrication, but it often stains the silicon wafer surface. Thus, this work systematically investigated the composition, source, and cleaning method of typical white spot stains on silicon wafer surfaces. The EDS and XPS results showed that the white spot stains contained CaCO3 and SiO2 that were consistent with the filler components in sticky silicon ingot glue. The effects of stains on copper deposition and copper-assisted chemical etching were studied. White spot stains remained attached to the silicon surface after deposition and etching. These stains affected the uniform deposition of copper particles on the surface of the silicon wafer and also impeded the catalytic etching of copper particles. Finally, KOH solution was combined with an ultrasonic field to remove surface stains from the silicon wafer. This study provides important guidance for the removal of silicon wafer contaminants to fabricate high-efficiency solar cells.

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Acoustic emission monitoring during laser shock cleaning of silicon wafers

Cited by 21 publications

References 4 publications

Optimisation of a paint coating ablation process by CO2 TEA laser: Thermal field modelling and real-time monitoring of the process

Optimisation of a paint coating ablation process by CO2 TEA laser: Thermal field modelling and real-time monitoring of the process

Simulation and experimental study of the evolution of shock waves during laser paint removal

Effect of Silicon Wafer Surface Stains on Copper-Assisted Chemical Etching

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