Achieving high thermal and mechanical properties of epoxy nanocomposites via incorporation of dopamine interfaced clay

Abstract

The uniform dispersion of clay in epoxy matrix and strong interfacial bonding between clay platelet and epoxy chains are crucial for achieving epoxy/clay with enhanced thermal and mechanical properties. In this study, dopamine hydrochloride was intercalated into the galleries of clay via ion‐exchange reaction with an aim to improve the dispersion and interfacial bonding with the epoxy matrix. Dopamine intercalated clay (D‐clay) was characterized by X‐ray photoelectron spectrum, Fourier Transform Infrared Spectroscopy, and X‐ray diffraction (XRD), respectively. Epoxy/D‐clay nanocomposites had been prepared by curing process of epoxy E51, Jeffamine D230, and D‐clay with 1, 2, 3, and 4 wt%, respectively. The structure of epoxy/D‐clay nanocomposites was characterized by XRD, scanning electron microscopy, and Transmission electron microscopy, respectively. The enhanced thermal properties and mechanical properties such as tensile strength, tensile modulus, and hardness were enhanced considerably compared with neat epoxy resin. The results found that the inclusion of 3 wt% D‐clay in the epoxy resin showed increase in Tg of 10.09°C, 29.34% increase in tensile strength, 23.19% increase in tensile modulus, and 53.87% increase in vickers hardness compared with neat epoxy resin. The uniform dispersion of clay platelets and strong interfacial hydrogen bonding between D‐clay and epoxy matrix afforded efficient load transfer across the epoxy‐clay interface, leading to significantly improved thermal and mechanical properties. POLYM. COMPOS., 39:E2407–E2414, 2018. © 2017 Society of Plastics Engineers

An Effective Approach to Improve the Thermal Conductivity, Strength, and Stress Relaxation of Carbon Nanotubes/Epoxy Composites Based on Vitrimer Chemistry

“…It could be explained that MWCNTs could increase the number of microcracks, which can limit the propagation of the cracks. Furthermore, the well-dispersed MWCNTs@PDA in the epoxy matrix and strong interfacial bonding could enhance the tensile strength [ 25 ]. The polar groups such as catechol and imine groups on the surfaces of MWCNTs@PDA could strongly enhance the interfacial interactions, thus bringing more effective stress transfer from high modulus MWCNTs to the epoxy matrix [ 26 ].…”

Renewable green reactive diluent for bisphenol a epoxy resin system: curing kinetics and properties

“…dðaÞ dðtÞ ¼ A expð ÀE a =RTÞð1 À aÞ n (8) The eqn ( 9) is obtained by a series of mathematical derivations. The reaction activation energy and the reaction order number n are added into eqn (9). We have calculated the curing kinetic equations of the P + 10% HSI-EP-EU and I + 10% HSI-EP-EU systems.…”

“…Epoxy resin and epoxy resin matrix composites 1 are widely used in aerospace, 2 building materials, 3 sports equipment, 4 biomaterials, 5 adhesives, 6 coatings 7 and other defense and civilian products, 8 due to their excellent adhesion, mechanical properties and thermal stability. 9 Compared with other thermosetting materials, epoxy resin has relatively good processing properties, but in fact the viscosity of epoxy resin is still high at room temperature, and researchers are also working to further improve the processing properties of epoxy resin. 10 Organic solvents are often used to reduce the viscosity of petroleum-based bisphenol A epoxy resin curing systems.…”

Effect of polyethylene terephthalate fiber reinforced with non‐hydrophilic nano‐silica on the mechanical, thermic, and chemical shielding characteristics of saturated polyurethane composite

“…56 Chen et al studied nano-silica as filler incorporated into poly-urethane synthesis for packaging electronic material shows improved tensile, elongation, the coefficient of thermal expansion, and the thermal conductivity. 68 The chemical modification to nano-silica added at the lowest weight percentage into polyurethane resin lead to increased cross-link density, thermal degradation temperature, and tensile strength. 57,58 Extremely oxidizable silica nanostructure with a concentration range of 0.5-2 wt% showed the cure rate and reduced reactivity of PU nanocomposite.…”

“…The nanoparticles are very significant even at a low concentration in increasing the physical properties of composite between 0.5 and 5 wt% 56 . Chen et al studied nano‐silica as filler incorporated into polyurethane synthesis for packaging electronic material shows improved tensile, elongation, the coefficient of thermal expansion, and the thermal conductivity 68 . The chemical modification to nano‐silica added at the lowest weight percentage into polyurethane resin lead to increased cross‐link density, thermal degradation temperature, and tensile strength 57,58 .…”