Achieving High Strength and High Electrical Conductivity in a CuCrZr Alloy Using Equal-Channel Angular Pressing

Tong, Y.X.; Wang, Yu; Qian, Zhi-Min; Zhang, Diantao; Li, Li; Zheng, Yufeng

doi:10.1007/s40195-018-0766-9

Cited by 19 publications

(8 citation statements)

References 20 publications

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“…As shown in Table 2 and Fig. 8, significant improvement in the YS and UTS were observed after processing via 1-P at RT, gradual increase occurred for ensuing passes which is in a good agreement with earlier study [37]. A dramatic increase in the YS (129.5%) and UTS (76%) were recorded after processing through 1-P, coupled with 39% reduction in EL in comparison with AA samples.…”

Section: Tensile Propertiessupporting

confidence: 89%

On the Effect of ECAP Processing Temperature on the Microstructure, Texture Evolution and Mechanical Properties of Commercial Pure Copper

Alateyah

2021

Adv. Mater. Lett.

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Section: Tensile Propertiessupporting

confidence: 89%

On the Effect of ECAP Processing Temperature on the Microstructure, Texture Evolution and Mechanical Properties of Commercial Pure Copper

Alateyah

2021

Adv. Mater. Lett.

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“…These properties are expected since the samples underwent refinement in grain size and a relative increase in HAGBs [60,61] as the number of passes increased; the recorded increase in HV, YS and UTS values after being processed via ECAP confirm this. As observed in Table 3, 1-P processing results in higher YS and UTS, processing any further resulted in a gradual increase in YS and UTS, which agrees with the results of [62]. Drastic increases of (129.5%) and (76%) in YS and UTS, respectively, were noticed after processing through 1-P at RT, alongside a reduction of 39% in the ductility, compared to the AA samples.…”

Section: Mechanical Propertiessupporting

confidence: 84%

Experimental and Numerical Investigation of the ECAP Processed Copper: Microstructural Evolution, Crystallographic Texture and Hardness Homogeneity

Alateyah

Ahmed

Zedan

et al. 2021

Metals

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The current study presents a detailed investigation for the equal channel angular pressing of pure copper through two regimes. The first was equal channel angular pressing (ECAP) processing at room temperature and the second was ECAP processing at 200 °C for up to 4-passes of route Bc. The grain structure and texture was investigated using electron back scattering diffraction (EBSD) across the whole sample cross-section and also the hardness and the tensile properties. The microstructure obtained after 1-pass at room temperature revealed finer equiaxed grains of about 3.89 µm down to submicrons with a high density of twin compared to the starting material. Additionally, a notable increase in the low angle grain boundaries (LAGBs) density was observed. This microstructure was found to be homogenous through the sample cross section. Further straining up to 2-passes showed a significant reduction of the average grain size to 2.97 µm with observable heterogeneous distribution of grains size. On the other hand, increasing the strain up to 4-passes enhanced the homogeneity of grain size distribution. The texture after 4-passes resembled the simple shear texture with about 7 times random. Conducting the ECAP processing at 200 °C resulted in a severely deformed microstructure with the highest fraction of submicron grains and high density of substructures was also observed. ECAP processing through 4-passes at room temperature experienced a significant increase in both hardness and tensile strength up to 180% and 124%, respectively.

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“…Large manufacturers have been evaluating nanostructuring by variations of equal channel angular pressing (ECAP) for copper [25][26][27] and aluminum 25,[27][28][29] to enhance conductivity, strength, and other properties. For example, 5% IACS increases in electrical conductivity have been reported for ECAP of AA6xxx alloys.…”

Section: Scaling Up To Large Volume Production: Example Of Electrical Conductorsmentioning

confidence: 99%

Commercialization of bulk nanostructured metals and alloys

Lowe

Valiev

et al. 2021

MRS Bulletin

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Almost 30 years of research elucidating the mechanisms and reproducibility of nanostructuring has enabled the progressive emergence of reliable methods to manufacture bulk nanostructured metallic materials with superior properties. This article reviews examples of the use of nanostructured metals in engineered products that are currently commercially available, or will soon become available for specific biomedical, aerospace, electronics, and energy industry applications. The examples illustrate how the making and marketing of nanostructured materials follow similar development stages as other new advanced materials, but with additional challenges at each stage. Challenges include the difficulties of scaleup, intricacies of nanoscale characterization, the lack of consensus standards for product quality, competition with long-established conventional materials, regulatory hurdles associated with nanoscale technology, and consumer/user education on the virtues and limitations of nanostructuring. Finally, we discuss how the experiences to date with nanostructuring by various methods have established precedents that can guide manufacturing process development for advanced nanostructured metal and alloy applications.

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Achieving High Strength and High Electrical Conductivity in a CuCrZr Alloy Using Equal-Channel Angular Pressing

Cited by 19 publications

References 20 publications

On the Effect of ECAP Processing Temperature on the Microstructure, Texture Evolution and Mechanical Properties of Commercial Pure Copper

On the Effect of ECAP Processing Temperature on the Microstructure, Texture Evolution and Mechanical Properties of Commercial Pure Copper

Experimental and Numerical Investigation of the ECAP Processed Copper: Microstructural Evolution, Crystallographic Texture and Hardness Homogeneity

Commercialization of bulk nanostructured metals and alloys

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