A method for accurately
measuring the relative dielectric constant
(εr) of thin films of soft, organic materials is
described. The effects of the bombardment of these materials with
hot Al atoms, the most commonly used top electrode, are mitigated
by using electrodes fabricated from eutectic gallium–indium
(EGaIn). The geometry of the electrode is defined by injection into
microchannels to form stable structures that are nondamaging and that
conform to the topology of the organic thin film. The εr of a series of references and new organic materials, polymers,
and fullerene derivatives was derived from impedance spectroscopy
measurements for both Al and EGaIn electrodes showing the specific
limitations of Al with soft, organic materials and overcoming them
with EGaIn to determine their dielectric properties and provide realistic
values of εr.