Achieving flexible and durable electromagnetic interference shielding fabric through lightweight and mechanically strong aramid fiber wrapped in highly conductive multilayer metal

Tang, Jianbin; Zhang, Xin; Wang, Jian; Zou, Ruiqing; Wang, Lijun

doi:10.1016/j.apsusc.2021.150577

Cited by 31 publications

(14 citation statements)

References 51 publications

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“…Additionally, the BFSM sample in the absence of a porous structure demonstrates a lower SE T value (Figure S3). The comparisons among BFL 1.8 SM 30 samples and typical EMI shielding materials with respect to shielding performances are shown in Figure d, and it is observed that the BFL 1.8 SM 30 sample has a superior SE T value in the reported references. ,,− …”

Section: Resultsmentioning

confidence: 96%

Flexible Sandwich-Structured Co–Ni Alloy-Coated Basalt Fabrics via the Writing–Grafting–Activation–Deposition Process for Electromagnetic Interference Shielding and Electrothermal Conversion

Chen

Hai

et al. 2022

ACS Appl. Electron. Mater.

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The proliferation of electronics and intensification of electromagnetic (EM) pollution have advanced exploration of high-performance flexible EM shielding materials. Herein, a writing−grafting−activation−deposition (WGAD) process for preparation of sandwich-structured Co−Ni alloy-coated basalt fabrics (BFs) is developed for acquiring excellent shielding performance. Benefiting from admirable electromagnetic properties of an electroless deposited Co−Ni alloy and interfacial porous structure induced by a laser, electromagnetic waves (EMWs) can be attenuated through dielectric loss, magnetic loss, and multiple reflections. The maximum total shielding effectiveness (SE T ) value of the designed fabric reaches 72.33 dB at the X-band (8.2−12.4 GHz) under conditions of a 1.8 W laser energy and 30 min deposition time. In addition, the designed fabric demonstrates outstanding electrothermal performance with commendable reliability and low driving voltage. Therefore, the as-prepared fabric through the WGAD process exhibits enormous prospects in applications of EMI shielding and wearable electronics.

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Section: Resultsmentioning

confidence: 96%

Flexible Sandwich-Structured Co–Ni Alloy-Coated Basalt Fabrics via the Writing–Grafting–Activation–Deposition Process for Electromagnetic Interference Shielding and Electrothermal Conversion

Chen

Hai

et al. 2022

ACS Appl. Electron. Mater.

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“…Due to the fact that stannous chloride has a relatively constant adsorption value on the surface of nonmetallic materials over a wide concentration range, it can be dispersed on the surface of OAP in the form of Sn(OH) 2 or Sn(OH)Cl during subsequent hydrolysis. 45 Meanwhile, the Cu layer and the OAP were not connected by chemical bonds, whereas it was by the in situ reaction product of Sn(OH) 2 or Sn(OH)Cl with Pd 2+ as the medium. In addition, minimizing the contact area between liquid and solid is a widely used strategy to enhance superhydrophobicity.…”

Section: Resultsmentioning

confidence: 99%

“…Also, prior to the electroless deposition of Cu on the OAP, it was treated via a two-step sensitization–activation method. Due to the fact that stannous chloride has a relatively constant adsorption value on the surface of nonmetallic materials over a wide concentration range, it can be dispersed on the surface of OAP in the form of Sn(OH) 2 or Sn(OH)Cl during subsequent hydrolysis . Meanwhile, the Cu layer and the OAP were not connected by chemical bonds, whereas it was by the in situ reaction product of Sn(OH) 2 or Sn(OH)Cl with Pd 2+ as the medium.…”

Section: Resultsmentioning

confidence: 99%

Combination of Universal Chemical Deposition and Unique Liquid Etching for the Design of Superhydrophobic Aramid Paper with Bioinspired Multiscale Hierarchical Dendritic Structure

Tang

Zou

Zhang

et al. 2022

ACS Appl. Mater. Interfaces

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It is urgent and significant for the further development of superhydrophobic materials to exploit a facile, low-cost, scalable, and eco-friendly method for the manufacture of superhydrophobic materials with self-cleaning, antifouling, directional transportation, and other characteristics. Herein, an outstanding superhydrophobic material composed of a flexible microconvex aramid paper substrate, micron-scale cone-shaped copper, micro−nanoscale dendritic copper oxide, and hydrophobic copper stearate film has been successfully constructed through delicate architectural design and a convenient preparation approach. Based on the microstructure evolution and composition analysis results, it is revealed that the cone-shaped copper was etched into a dendritic copper oxide structure step by step from the top to bottom and from the outside to inside in an alkaline liquid environment. Moreover, by virtue of the compositional features and structural characteristics, the constructed superhydrophobic material showcased a high contact angle (CA), low sliding angle (SA), high porosity, low surface free energy, and adhesion work. Meanwhile, the dendritic microstructure analysis, the calculation of solid−liquid interfacial tension, and the force analysis of water droplets jointly revealed the mechanism of the bounce and merged bounce of water droplets. Finally, this superhydrophobic material has the functions of self-cleaning, antifouling, and directional transportation, especially by controlling the deformation of the material to realize the transportation of water droplets in a specified direction.

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“… 17 Electroless plating is advantageous, in that it does not need large-scale instruments and equipment, which makes it possible to fabricate conductive aramid fibers at industrial scale. 18 − 20 In addition, the electroless plating process does not damage the mechanical properties of the fibers, which is essential in ensuring the usability of the fiber products.…”

Section: Introductionmentioning

confidence: 99%

“…Conductive aramid fibers have attracted extensive attention from researchers, as they can be used to fabricate functional fiber devices. , Various methods have been reported to prepare conductive aramid fibers, for example, blend spinning of conductive components and aramid polymers, chemical coating with conductive polymers, electrodeposition and electroless deposition of silver, nickel, or other metals, , and vacuum or sputter plating . Electroless plating is advantageous, in that it does not need large-scale instruments and equipment, which makes it possible to fabricate conductive aramid fibers at industrial scale. − In addition, the electroless plating process does not damage the mechanical properties of the fibers, which is essential in ensuring the usability of the fiber products.…”

Section: Introductionmentioning

confidence: 99%

Conductive Aramid Fibers from Electroless Silver Plating of Crosslinked HPAMAM-Modified PPTA: Preparation and Properties

et al. 2022

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Conductive aramid (PPTA) fibers are highly needed for making flexible conductive materials, antistatic materials, and electromagnetic shielding materials. In this work, silver-plated conductive PPTA fibers with high conductivity and excellent mechanical properties were prepared by the electroless plating of PPTA fibers modified with crosslinked hyperbranched polyamide-amine (HPAMAM). The crosslinked HPAMAM creates a stable interface between the PPTA fibers and the silver plating. The morphology and physicochemical properties of the modified and the silver-plated fibers were characterized by Fourier transform infrared spectroscopy, scanning electron microscopy, atomic force microscopy, X-ray diffraction, X-ray photoelectron spectroscopy, and thermogravimetric analysis. Three epoxy crosslinking agents with different chain lengths were used to crosslink HPAMAM, and the effects of HPAMAM concentration, crosslinking agent dosage, and crosslinking time on the resistance of the fibers were studied. The long chain crosslinking agent appears to be beneficial to silver plating. The lowest resistance (0.067 Ω/cm) was attained when HPAMAM was modified by diethylene glycol diglycidyl ether (1:1 molar ratio), and 20 g/L HPAMAM was used to modify the PPTA fibers. The tensile strength of the original PPTA fibers decreased by only 3% or less after silver plating.

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Achieving flexible and durable electromagnetic interference shielding fabric through lightweight and mechanically strong aramid fiber wrapped in highly conductive multilayer metal

Cited by 31 publications

References 51 publications

Flexible Sandwich-Structured Co–Ni Alloy-Coated Basalt Fabrics via the Writing–Grafting–Activation–Deposition Process for Electromagnetic Interference Shielding and Electrothermal Conversion

Flexible Sandwich-Structured Co–Ni Alloy-Coated Basalt Fabrics via the Writing–Grafting–Activation–Deposition Process for Electromagnetic Interference Shielding and Electrothermal Conversion

Combination of Universal Chemical Deposition and Unique Liquid Etching for the Design of Superhydrophobic Aramid Paper with Bioinspired Multiscale Hierarchical Dendritic Structure

Conductive Aramid Fibers from Electroless Silver Plating of Crosslinked HPAMAM-Modified PPTA: Preparation and Properties

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