Accurate power supply and ground plane pair models

Wu, Hengtian; Meyer, Jeff; Lee, K.; Barber, A.

doi:10.1109/epep.1998.733946

Cited by 32 publications

(28 citation statements)

References 3 publications

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“…Basic cell models incorporate mutual capacitance, inductance, resistance, dielectric loss, radiation loss, and skin effects. One advantage of the PEEC method over alternate numerical approaches is the capability to reduce the order of circuit description equations and to derive simple SPICE-compatible cell models [5,6]. For gridded planes, a mismatch between the PEEC cell size and the plane gridding leads to non-uniformity in the PEEC cell layout.…”

Section: Modeling Methodologymentioning

confidence: 99%

Accurate frequency domain modeling of LTCC solid‐gridded plane structures

Chen

Jancura

Virga

et al. 2003

Micro & Optical Tech Letters

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Shrinkage behavior of a plastic plays a critical role in determining the final dimensions of an injection‐molded part. It is well known that process conditions affect many properties of plastic parts, including shrinkage. This study applies the Taguchi method to systematically investigate the effects of process conditions on the shrinkage (along‐ and across‐the‐flow directions) of three plastics: high‐density polyethylene (HDPE), general‐purpose polystyrene (GPS), and acrylonitrile‐butadiene‐styrene (ABS). The results show that HDPE, a semicrystalline plastic, shrinks more than GPS and ABS, two amorphous materials. The extent of anisotropic shrinkage in the along‐the‐flow and across‐the‐flow directions for HDPE is different from GPS and ABS. More shrinkage occurs in the across‐the‐flow direction of HDPE than in its along‐the‐flow direction. The reverse is true for GPS and ABS. Mold and melt temperatures, along with holding pressure and holding time, are the most significant influences on the shrinkage behaviors of three materials, although the importance of each is different for each plastic. The optimal conditions for reducing shrinkage identified by the Taguchi method are experimentally verified and validated by t‐statistic tests. The prediction matches very well with the experimental value for the along‐the‐flow shrinkage of GPS.

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Section: Modeling Methodologymentioning

confidence: 99%

Accurate frequency domain modeling of LTCC solid‐gridded plane structures

Chen

Jancura

Virga

et al. 2003

Micro & Optical Tech Letters

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“…Power bus resonance characteristics have been investigated with various models, such as a full cavity-mode resonator model [l], a distributed lumped-element equivalent circuit model [2], a partial element equivalent circuit (PEEC) approach [3] and its extension [4], and numerical models based on a finite-difference timedomain method [5]. Based on the full cavitymode resonator model, a fast algorithm can be applied for accurately calculating power bus impedance characteristics.…”

Section: Introductionmentioning

confidence: 99%

Analysis of resonance characteristics of a power bus with rectangle and triangle elements in multilayer PCBs

Wang

Wada

Toyota

et al. 2003

Asia-Pacific Conference on Environmental Electromagnetics, 2003. CEEM 2003. Proceedings.

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“…Lumped-element equivalent circuits have been demonstrated for traditional power planes [24]- [26], but none has been proposed for parallel-plate waveguides with integrated HIS. The only model that exists for stand-alone HIS is based on the transmission line theory and is developed for two main directions of wave propagation [27].…”

Section: A Model Form Definitionmentioning

confidence: 99%

Design and Modeling of High-Impedance Electromagnetic Surfaces for Switching Noise Suppression in Power Planes

Kamgaing

Ramahi

2005

IEEE Trans. Electromagn. Compat.

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Abstract-This paper presents a detailed design and modeling approach for power planes with integrated high-impedance electromagnetic surfaces (HIS). These novel power planes, which were introduced recently, have the unique ability of providing effective broadband simultaneous switching noise (SSN) mitigation. Fullwave electromagnetic simulation is used to study the impact of the geometry on the performance of these novel power planes. It is demonstrated that power planes using inductance-enhanced HIS can be designed for broadband mitigation of the SSN from the upper hundred megahertz to the gigahertz frequencies. Physicsbased compact models for the unit cell of power planes with integrated HIS are developed and several of them connected in a two-dimensional array to build full models for large and multilayer power planes. The compact model offers fast analysis of power planes. As an example, we show that the full-wave simulation time of a 10 × 10 cm power plane with integrated HIS can be dramatically reduced from 24 to 48 h using a commercially available three-dimensional full-wave solver to less than 1 min when using the compact circuit model developed here.

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Accurate power supply and ground plane pair models

Cited by 32 publications

References 3 publications

Accurate frequency domain modeling of LTCC solid‐gridded plane structures

Accurate frequency domain modeling of LTCC solid‐gridded plane structures

Analysis of resonance characteristics of a power bus with rectangle and triangle elements in multilayer PCBs

Design and Modeling of High-Impedance Electromagnetic Surfaces for Switching Noise Suppression in Power Planes

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