1993
DOI: 10.1063/1.354551
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Accurate measurements of the silicon intrinsic carrier density from 78 to 340 K

Abstract: The intrinsic carrier density in silicon has been measured by a novel technique based on low-frequency capacitance measurements of a p+-i-n+ diode biased in high injection. The major advantage of the method is its insensitivity to uncertainties regarding the exact values of the carrier mobilities, the recombination parameters, and the doping density. The intrinsic carrier density was measured in the temperature range from 78 to 340 K. At 300 K the value of ni was found to be (9.7±0.1)×109 cm−3.

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Cited by 118 publications
(58 citation statements)
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“…4(b). It implies that BGN starts to have an effect at very low dopant densities, so Sproul and Green's experiment yielded n i,eff instead of n i , and n i turned out to be n i = 9.65(3) × 10 9 cm −3 [83], consistent with the value of Misiakos and Tsamakis [82]. The fact that Schenk's BGN model was successful had two further implications.…”
Section: Models For Band Parameterssupporting
confidence: 65%
See 1 more Smart Citation
“…4(b). It implies that BGN starts to have an effect at very low dopant densities, so Sproul and Green's experiment yielded n i,eff instead of n i , and n i turned out to be n i = 9.65(3) × 10 9 cm −3 [83], consistent with the value of Misiakos and Tsamakis [82]. The fact that Schenk's BGN model was successful had two further implications.…”
Section: Models For Band Parameterssupporting
confidence: 65%
“…4(b), so the average was taken, which is n i = 1.00(3) × 10 10 cm −3 [81] (the digit in the parentheses represents the estimated onestandard-deviation uncertainty in the last digit of the previous value). However, this value was significantly higher than 9.7(1) × 10 9 cm −3 as determined with admittance measurements by Misiakos and Tsamakis [82] and is shown as square symbol in Fig. 4(b).…”
Section: Models For Band Parametersmentioning
confidence: 80%
“…To achieve high-efficiency screen-printed n-type silicon solar cells, an optimal boron emitter is needed to balance emitter sheet resistance, contact resistance and emitter saturation current density J oe shown in Eq. (13). This can be achieved by flexibly controlling implant energy, boron ion dose and post-implantation annealing conditions.…”
Section: Boron Emitter Formationmentioning
confidence: 99%
“…where the intrinsic carrier concentration n _ i = 8.3 × 10^9 cm^( − 3) [13]. N D is the doping density of n-type silicon bulk region, i.e., N _ D = 9.2 × 10^14 cm^( − 3) for a bulk resistivity of 5 Ω cm.…”
Section: ( )mentioning
confidence: 99%
“…(5.5) temperature dependence can be modeled by including the n i vs. temperature relation in Eq. (5.5) as described by [101]:…”
Section: Temperature Dependencementioning
confidence: 99%