Accumulation of Defects in Polycrystalline Copper–Aluminum Solid Solutions and the Role of Stacking Fault Energy

Abstract

Transmission diffraction electron microscopy is used to study the evolution of a dislocation structure during active plastic deformation in copper-aluminum alloys in the 0-14 at % Al range of concentrations. Types of dislocation substructures are determined from micrographs, depending on the concentration of the alloying element. The parameters of the defect structure are measured and their relationship to stacking fault energy is established.